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References
Joseph Fjelstad, “Tutorial: An Overview of Flexible Printed Circuits”, Chip Scale Review, January-February (2001).
John Lau, “Handbook of Tape Automate Bonding”, Springer-Verlag, New York, NY (1991).
James J. Licari, Leonard R. Enlow, “Hybrid Microcircuit Technology Handbook”, Chapter 7, Noyes Publications, New York, NY (1998).
Michael Pecht, et al.“Integrated Circuit, Hybrid, and Multichip Module Packaging; A focus on Reliability”, Chapter 6, Wiley Interscience, New York, NY (1994).
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Michael Pecht,et al.“Quality Conformance and Qualification of Microelectronic Packaging and Interconnects”, Chapter 8, Wiley Interscience, New York, NY (1994).
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(2007). Tape Automated Bonding—TAB. In: Integrated Circuit Packaging, Assembly and Interconnections. Springer, Boston, MA. https://doi.org/10.1007/0-387-33913-2_9
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DOI: https://doi.org/10.1007/0-387-33913-2_9
Publisher Name: Springer, Boston, MA
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