Keywords

Wire Bonding Ball Bonding Fine Pitch Electroless Nickel Immersion Gold Ball Shear Testing 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. [1]
    George Harmon, “Wire Bonding in Microelectronics”, Second Edition, McGraw Hill, New York, NY (1997). Google Scholar
  2. [2]
    Jeffrey Rodengen, “50 Years of Innovation”, Write Stuff Enterprises Inc., Fort Lauderdale, F (2002). Google Scholar
  3. [3]
    James J. Licari and Leonard R. Enlow, “Hybrid Microcircuit Technology Handbook”, Chapter 7, Noyes Publications, New York, NY (1998). Google Scholar
  4. [4]
    Michael Pecht, et al.“Integrated Circuit, Hybrid, and Multichip Module Packaging; A focus on Reliability”, Chapter 5, Wiley Interscience, New York, NY (1994). Google Scholar
  5. [5]
    Lee Levine and Michael Deley, “An Update on High Volume Copper Ball Bonding”, IMAPS Conference Proceedings, November (2004). Google Scholar
  6. [6]
    Ivy Wei Qin, “Wire Bonding Tutorial”, Advanced Packaging, July (2005). Google Scholar
  7. [7]
    Bonding Capillary Catalog, Kulicke and Soffa. Google Scholar
  8. [8]
    Bonding Wedge Catalog, Kulicke and Soffa. Google Scholar
  9. [9]
    Semiconductor and Hybrid Microelectronics Wire Bonding Tools, Brochure, Gaiser Tool Company. Google Scholar
  10. [10]
    Bonding Capillaries, Small Precision Tools. Google Scholar
  11. [11]
    Michael Pecht, et al.“Quality Conformance and Qualification of Microelectronic Packaging and Interconnects”, Chapter 6, Wiley Interscience, New York, NY (1994). Google Scholar
  12. [12]
    James Getty, “Technology Drivers for Plasma Prior to Wire Bonding—Plasma Enhances Package Yield and Reliability”, Advanced Packaging, December (2004). Google Scholar
  13. [13]
    Ron Iscoff, “Wire Bonder Report: The Evolution Continues”, Chip Scale Review, March (2004). Google Scholar
  14. [14]
    Lee Levine, “The Advent of Area Array Wire Bonding”, Chip Scale Review, December (2003). Google Scholar
  15. [15]
    S. Tang and Gary Gillotti, “Wire-Loop Shaping in Multi-Tier Packages”, Semiconductor International, August (2005). Google Scholar
  16. [16]
    Laurie Roth and Glenn Sandgren, “Semiconductor Packaging—Wire Encapsulation”, Advanced Packaging, October (2004). Google Scholar
  17. [17]
    “About X-Wire™ Technology”, Microbonds Inc., www.microbonds.com/index.html.

Copyright information

© Springer Science+Business Media LLC 2007

Personalised recommendations