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Keywords

Ball Bond Flip Chip Gold Ball Wire Bonding Process Wafer Level Package 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. [1]
    Michael Pecht, et al.“Quality Conformance and Qualification of Microelectronic Packaging and Interconnects”, Chapter 4, Wiley Interscience, New York, NY (1994). Google Scholar
  2. [2]
    “Chip on Board”, Tutorial, Die Products Consortium, available at www.dieproducts.org/tutorials/assembly/cob/index.php.
  3. [3]
    M. Lithra, “Going Mainstream with Chip-on-Board”, Circuits Assembly, January (2002). Google Scholar
  4. [4]
    “Die Products Assembly Options”, National Semiconductor Die Products Business Unit, Application Note, September (2000); available at www.national.com/appinfo/die/0,1826,857,00.html.
  5. [5]
    “Chip-on-Board and Flip Chip Implementation”, National Semiconductor Die Products Business Unit, Application Note, September (2000); available at www.national.com/appinfo/die/0,1826,857,00.html.

Copyright information

© Springer Science+Business Media LLC 2007

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