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The Chip Scale Package

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References

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© 2007 Springer Science+Business Media LLC

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(2007). The Chip Scale Package. In: Integrated Circuit Packaging, Assembly and Interconnections. Springer, Boston, MA. https://doi.org/10.1007/0-387-33913-2_4

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  • DOI: https://doi.org/10.1007/0-387-33913-2_4

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-28153-7

  • Online ISBN: 978-0-387-33913-9

  • eBook Packages: EngineeringEngineering (R0)

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