Skip to main content
SpringerLink
Log in

Electrically Conductive Adhesives: A Research Status Review

  • Chapter
Book cover Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 429.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 549.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 549.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. J. Kivilahti (personal communication).

    Google Scholar 

  2. J.E. Morris, Conduction mechanisms and microstructure development in isotropic, electrically conductive adhesives, in J. Liu, Ed., Chapter 3 of Conductive Adhesives for Electronics Packaging, Electrochemical Publications, Ltd., UK, 1999, pp. 36–77.

    Google Scholar 

  3. R.P. Kusy, Influence of Particle size ratio on the continuity of aggregates, J. Appl. Phys., 48(12), pp. 5301–5305 (1977).

    Article  Google Scholar 

  4. L. Li, H. Kim, C. Lizzul, I. Sacolick, and J.E. Morris, Electrical, structure and processing properties of electrically conductive adhesives, IEEE Trans. Compon. Packag. Manuf. Technol., 16(8), pp. 843–851 (1993).

    Article  Google Scholar 

  5. Y. Fu, J. Liu, and M. Willander, Conduction modeling of conductive adhesive with bimodal distribution of conducting element, International Journal of Adhesion and Adhesives, (Dec.), pp. 281–286 (1998).

    Google Scholar 

  6. L. Li, Ph.D. dissertation, Basics and applied studies of electrically conductive adhesives, State university of New York at Binghamton, 1995.

    Google Scholar 

  7. J. Constable, T. Kache, S. Muehle, H. Teichmann, and M. Gaynes, Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints, IEEE Trans. Compon. Packag. Technol., 22(2), pp. 191–199 (1999).

    Article  Google Scholar 

  8. P. Li, E. Cotts, Y. Guo, and G. Lehmann, Viscosity measurements and models of underfill mixtures, Proc. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY (Adhesives’98), Sept., 1998, pp. 328–333.

    Google Scholar 

  9. M. Mundlein and J. Nicolics, Modeling of particle arrangement in an isotropically conductive adhesive joint, Proc. 4th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, Oregon, 2004, PP-3.

    Google Scholar 

  10. E. Sancaktar and N. Dilsiz, Anisotropic alignment of nickel particles in magnetic field for electrically conductive adhesives application, J. Adhesion Sci. Technol., II(2), pp. 155–166 (1997).

    Google Scholar 

  11. T. Inada and C.P. Wong, Fundamental study on adhesive strengh of electrical conductive adhesives (ECAs), Proc. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton NY (Adhesives’98), Sept., 1998, pp. 156–159.

    Google Scholar 

  12. J.E. Morris, C. Cook, M. Armann, A. Kleye, and P. Fruehauf, Electrical conduction models for electrically conductive adhesives, Proc. 2nd IEEE International Symposium Polymeric Electronics Packaging (PEP’ 99), Gothenburg, Sweden, 1999, pp. 15–25.

    Google Scholar 

  13. E. Sancaktar and N. Dilsiz, Thickness dependent conduction behavior of various particles for conductive adhesive applications, Proc. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY (Adhesives’98), Sept., 1998, pp. 90–95.

    Google Scholar 

  14. L. Li and J.E. Morris, Electrical conduction models for isotropically conductive adhesives, J. Electronics Manuf., 5(4), pp. 289–298 (1996).

    Article  Google Scholar 

  15. L. Li and J.E. Morris, Electrical conduction models for isotropically conductive adhesive joints, IEEE Trans. Compon. Packag. Manuf. Technol. Part A., 20(1), pp. 3–8 (1997).

    Article  Google Scholar 

  16. P. McCluskey, J.E. Morris, V. Verneker, P. Kondracki, and D. Finello, Models of electrical conduction in nanoparticle filled polymers, Proc. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY (Adhesives’98), Sept., 1998, pp. 84–89.

    Google Scholar 

  17. G.G.W. Mustoe, M. Nakagawa, X. Lin, and N. Iwamoto, Simulation of particle compaction for conductive adhesives using discrete element modeling, Proc. 49th IEEE Electronic Components and Technology Conference, San Diego, 1999, pp. 353–359.

    Google Scholar 

  18. M. Mundlein, G. Hanreich, and J. Nicolics, Simulation of the aging behavior of isotropic conductive adhesives, Proc. 2nd International IEEE Confer. Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2002), Zalaegerszeg, Hungary, 2002, pp. 68–72.

    Google Scholar 

  19. L. Li and J.E. Morris, Structure and selection models for anisotropic conductive adhesives films, Proc. 1st International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives’94), Berlin, Germany, 1994.

    Google Scholar 

  20. A.O. Ogunjimi, S.H. Mannan, D.C. Whalley, and D.J. Williams, Assembly of planar array components using anisotropic conducting adhesives—A benchmark study, Proc. 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics, ’96), Stockholm, 1996, pp. 270–284.

    Google Scholar 

  21. D.J. Williams and D.C. Whalley, The effects of conducting particle distribution on the behavior of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections, Journal of Electronics Manufacturing, 3, pp. 85–94 (1993).

    Article  Google Scholar 

  22. R. Herczynski, Distribution function for random distribution of spheres, Nature, 255, pp. 540–541 (1975).

    Article  Google Scholar 

  23. D.J. Williams, D.C. Whalley, O.A. Boyle, and A.O. Ogunjimi, Anisotropic conducting adhesives for electronic interconnection, Soldering and Surface Mount Technology, (14), pp. 4–8 (1993).

    Google Scholar 

  24. S.H. Mannan, D.J. Williams, D.C. Whalley, and A.O. Ogunjimi, Models to determine guidelines for the anisotropic conducting adhesives joining process, in J. Liu, Ed., Chapter 4 of Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., UK, 1999, pp. 78–98.

    Google Scholar 

  25. F. Shi, M. Abdulla, S. Chungpaiboonpatana, K. Okuyama, C. Davidson, and J. Adams, Electrically anisotropic conductive adhesives: a new model for conduction mechanism, Proc. 5th International Symposium Advanced Packaging Materials, Braselton, GA, 1999, pp. 163–168.

    Google Scholar 

  26. D. Klosterman, L. Li, and J.E. Morris, Materials characterization, conduction development, and curing effects on reliability of isotropically, IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 21(1), pp. 23–31 (1998).

    Article  Google Scholar 

  27. L. Li and J.E. Morris, Modeling cure schedules for electrically conductive adhesives, in J. Liu, Ed., Chapter 5 of Electrically Conductive Adhesives: A Comprehensive Review, Electrochemical Press, UK, 1999, pp. 99–116.

    Google Scholar 

  28. J.E. Morris and S. Probsthain, Investigations of plasma cleaning on the reliability of electrically conductive adhesives, Proc. 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics), Espoo, Finland, 2000, pp. 41–45.

    Google Scholar 

  29. M.G. Perichaud, J.Y. Deletage, D. Carboni, H. Fremont, Y. Danto, and C. Faure, Thermomechanical behavior of adhesive jointed SMT components, Proc. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY (Adhesives’98), Sept., 1998, pp. 55–61.

    Google Scholar 

  30. O. Rusanen and J. Laitinen, Reasons for using lead-free solders rather than isotropically conductive adhesives in mobile phone manufacturing, Proc. 4th International Confer. Polymers and Adhesives in Microelectronics and Photonics, Portland, Oregon, 2004, pp. 2–4.

    Google Scholar 

  31. Y. Wei, Ph.D. dissertation, Electronically conductive adhesives: conduction mechanisms, mechanical behavior and durability, Clarkson University, 1995.

    Google Scholar 

  32. J.E. Morris and J.H. Das, in J.E. Morris, Ed., Electronics Packaging Forum, Vol. 3, IEEE Press, 1994, pp. 41–71.

    Google Scholar 

  33. J.E. Morris and J. Das, Metal diffusion in polymers, IEEE Trans. Compon. Packag. Manuf. Technol.- Part B: Adv. Pkg., 17(4), pp. 620–625 (1994).

    Article  Google Scholar 

  34. E. Sencaktar, P. Rajput, and A. Khanolkar, Correlation of silver migration to the pull-out strength of silver wire embedded in an adhesive matrix, Proc. 4th International Confer. Polymers and Adhesives in Microelectronics and Photonics, Portland, Oregon, 2004, RT2-1.

    Google Scholar 

  35. K.S. Moon, J. Wu and C.P. Wong, Improved stability of contact resistance of low meting point alloy incorporated isotropically conductive adhesives, IEEE Trans. Compon. Packag. Technol., 26(2), pp. 375–381 (2003).

    Article  Google Scholar 

  36. C.P. Wong and Y. Li, Recent advances on Electrical Conductive Adhesives (ECAs), Proc. 4th International Conference Polymers and Adhesives in Microelectronics and Photonics, Portland, Oregon, 2004, PL-1.

    Google Scholar 

  37. K. Suzuki, Y. Shirai, N. Mizumura, and M. Konagata, Conductive adhesives containing Ag-Sn alloys as conductive filler, Proc. 4th International Conference Polymers and Adhesives in Microelectronics and Photonics, Portland, Oregon, 2004, MP3-1.

    Google Scholar 

  38. P. Smilauer, Thin metal films and percolation theory, Contemp. Phys., 32, pp. 89–102, (1991).

    Google Scholar 

  39. G.R. Ruschau, S. Yoshikawa, and R.E. Newnham, Percolation constraints in the use of conductor-filled polymers for interconnects, Proc. 42nd Electronic Components and Technology Conference, Atlanta GA, May 1992, pp. 481–486.

    Google Scholar 

  40. J.E. Morris, F. Anderssohn, E. Loos, and J. Liu, Low-tech studies of isotropic electrically conductive adhesives, Proc. 26th International Spring Seminar on Electronics Technology, Stara, Lesna, Slovak Republic, 2003, pp. 90–94.

    Google Scholar 

  41. J.E. Morris, F. Anderssohn, S. Kudtarkar, and E. Loos, Reliability studies of an isotropic electrically conductive adhesive, Proc. 1st International IEEE Conference Polymers and Adhesives in Microelectronics and Photonics, 2001, Potsdam, Germany, pp. 61–69.

    Google Scholar 

  42. R. Zallen, The Physics of Amorphous Solids, Chapter 4, Wiley, New York, 1983.

    Book  Google Scholar 

  43. J.E. Morris, S. Youssof, and X. Feng, Electrically conductive adhesives for pin-through-hole applications, J. Electronics Manuf., 6(3), pp. 219–230 (1996).

    Article  Google Scholar 

  44. C.P. Wong, D. Lu, and Q. Tong, Lubricants of silver fillers for conductive adhesive applications, Proc. 3rd International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY (Adhesives’98), Sept., 1998, pp. 184–192.

    Google Scholar 

  45. E. Sancaktar and N. Dilsiz, Pressure dependent conduction behavior of various particles for conductive adhesive applications, Proc. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY (Adhesives’98), Sept., 1998, pp. 334–344.

    Google Scholar 

  46. U. Behner, R. Haug, R. Schutz, and H.L. Hartnagel, Characterization of anisotropically conductive adhesive interconnections by 1/f noise measurements, Polymers in Electronics Packaging Conference, Norrkoping, Sweden, 1997, pp. 243–248.

    Google Scholar 

  47. L.K.J. Vandamme, M. Perichaud, E. Noguera, Y. Danto, and U. Buehner, 1/f noise as a diagnostic tool to investigate the quality of isotropic conductive adhesive bonds, IEEE Trans. Compon. Packag. Technol., 22(3), pp. 446–454 (1999).

    Article  Google Scholar 

  48. Y. Li, K. Moon, H. Li, and C.P. Wong, Conductive improvement of isotropically conductive adhesives, Proc. 6th IEEE CPMT Conference High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’04), Shanghai, 2004, pp. 236–241.

    Google Scholar 

  49. J. Miragliotta, R.C. Benson, and T.E. Phillips, Measurements of electrical resistivity and raman scattering from conductive die attach adhesives, Proc. 8th International Symposium Advanced Packaging Materials, Stone Mountain, GA, 2002, pp. 132–138.

    Google Scholar 

  50. H. Kim, State University of New York at Binghamton, unpublished data (1992).

    Google Scholar 

  51. S. Kottaus, R. Haug, H. Schaefer, and B. Guenther, Investigation of isotropically conductive adhesives filled with aggregates of nano-sized Ag-particles, Proc. 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics ’96) Stockholm, 1996, pp. 14–17.

    Google Scholar 

  52. B. Guenther and H. Schaefer, Porous metal powders for conductive adhesives, Proc. 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics, ’96), Stockholm, 1996, pp. 55–59.

    Google Scholar 

  53. J. Liu, K. Gustafsson, Z. Lai, and C. Li, Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallisations, Proc. 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics, ’96), Stockholm, 1996, pp. 141–153.

    Google Scholar 

  54. L. Li, J.E. Morris, J. Liu, Z. Lai, L. Ljungkrona, and C. Li, Reliability and failure mechanism of isotropically conductive adhesives, Proc. 45th Electronic Components and Technology Conference, Las Vegas, NV, May 1995, pp. 114–120.

    Google Scholar 

  55. H. Botter, R.B. Van Der Plas, and A.A. Junai, Factors that influence the electrical contact resistance of isotropic conductive adhesive joints during climate chamber testing, Int. J. Microelec. Pkg., 1(3), pp. 177–186 (1998).

    Google Scholar 

  56. D. Lu, C.P. Wong, and Q.K. Tong, Mechanisms underlying the unstable contact resistance of conductive adhesives, Proc. 49th Electronic Components and Technology Conference, San Diego, June 1999, pp. 324–346.

    Google Scholar 

  57. D. Lu and C.P. Wong, Conductive adhesives with improved properties, Proc. 2nd International Symposium Polymeric Electronics Packaging (PEP’99), Gothenburg, Sweden, 1999, pp. 1–8.

    Google Scholar 

  58. S. Wu, K. Hu, and C.P. Yeh, Contact reliability modeling and material behavior of conductive adhesives under thermomechanical loads, in J. Liu, Ed., Chapter 6 of Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., UK, 1999, pp. 117–150.

    Google Scholar 

  59. M. Dernevik, R Sihlbom, Z. Lai, P. Starski, and J. Liu, High frequency measurements and modeling of anisotropic, electrically conductive adhesive flip-chip joint, Advances in Electronics Packaging, 1997, EEP-Vol. 19-1, ASME, 1997, pp. 177–184.

    Google Scholar 

  60. R. Sihlbom, M. Dernevik, Z. Lai, P. Starski, and J. Liu, High-frequency measurements and simulation on the Sequential Build-Up Boards (SBU), Proc. 1st International Symposium on Polymeric Electronics Packaging (PEP’97), Norrköping, Sweden, 1997, pp. 131–139.

    Google Scholar 

  61. A. Kulkarni and J. Morris, Reliability life time studies on isotropic conductivity adhesives, Proc. 3rd International IEEE Conference Polymers and Adhesives in Microelectronics and Photonics, Montreux, Switzerland, 2003, pp. 333–336.

    Google Scholar 

  62. M.J. Yim and K.W. Paik, Design and understanding of Anisotropic Conductive Films (ACF’s) for LCD packaging, IEEE Trans. Compon. Packag. Manuf. Technol., Part A, 21(2), pp. 226–234 (1998).

    Article  Google Scholar 

  63. C. Oguibe, S. Mannan, D. Whalley, and D. Williams, Conduction mechanisms in anisotropic conducting adhesive assembly, IEEE Trans. Compon. Packag. Manuf. Technol., Part A, 21(2), pp. 235–242 (1998).

    Article  Google Scholar 

  64. Y. Fu, Y.L. Wang, X. Wang, J. Liu, Z. Lai, G.L. Chen, and M. Willander, Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesive, IEEE Trans. Compon. Packag. Manuf. Technol., Park B, Advance Packaging, 23(1), pp. 15–21 (2000).

    Google Scholar 

  65. R. Sihlbom, M. Dernevik, M. Lindgren, P. Starski, Z. Lai, and J. Liu, High frequency measurements and simulations on wire-bonded modules on the Sequential Build-Up boards (SBU’s), IEEE Trans. Compon. Packag. Manuf. Technol., Part A, 21(3), pp. 478–491 (1998).

    Article  Google Scholar 

  66. J. Kim, Proc. 2nd International Academic Conference, March 17–19, Atlanta, USA, 2000.

    Google Scholar 

  67. Y. Fu, J. Liu, and M. Willander, Electromagnetic wave transmission through lossless electrically conductive adhesive, Journal of Electronics Manufacturing, 9(4), pp. 275–281 (1999).

    Article  Google Scholar 

  68. A. Paproth, K.-J. Wolter, T. Herzog, and T. Zerna, Influence of plasma treatment on the improvement of surface energy, Proc. 24th International Spring Seminar Electronics Technology, Romania, 2001, pp. 37–41.

    Google Scholar 

  69. T. Herzog, M. Koehler, and K.-J. Wolter, Improvement of the adhesion of new memory packages by surface engineering, Proc. 2004 Electronic Components and Technology Conference, Las Vegas, 2004, Vol. 1, pp. 1136–1141.

    Google Scholar 

  70. S. Liong, C.P. Wong, and W.F. Burgoyne, Jr., Adhesion improvement of thermoplastic isotropically conductive adhesives, Proc. 8th International Symposium on Advanced Packaging Materials, Braselton, GA, 2002, pp. 260–270.

    Google Scholar 

  71. L.L.W. Chow, J. Li, and M.M.F. Yuen, Development of low temperature processing thermoplastic intrinsically conductive polymer, Proc. 8th International Symposium on Advanced Packaging Materials, Braselton, GA, 2002, pp. 127–131.

    Google Scholar 

  72. R. Luchs, Application of electrically conductive adhesives in SMT, Proc. 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics, ’96), Stockholm, 1996, pp. 76–83.

    Google Scholar 

  73. M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri, R. Hermansen, S. Lau, and D. Napp, Electrically conductive adhesives for surface mount solder replacement, Proc. 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics, ’96), Stockholm, 1996, pp. 333–340.

    Google Scholar 

  74. Q. Tong, S. Vona, R. Kuder, and D. Shenfield, Recent advances in surface mount conductive adhesives, Proc. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY (Adhesives’98), Sept., 1998, pp. 272–277.

    Google Scholar 

  75. S. Vona, Q. Tong, R. Kuder, and D. Shenfield, Surface mount conductive adhesives with superior impact resistance, Proc. 4th International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA, 1998, pp. 261–267.

    Google Scholar 

  76. S. Luo and C.P. Wong, Thermo-mechanical properties of epoxy formulations with low glass transition temperatures, Proc. 8th International Symposium on Advanced Packaging Materials, Braselton, GA, 2002, pp. 226–231.

    Google Scholar 

  77. S.A. Kudtarkar and J.E. Morris, Reliability studies of isotropic conductive adhesives: drop test for thermally cycled and 85/85 tested samples, Proc. 8th International Symposium on Advanced Packaging Materials, Braselton, GA, 2002, pp. 144–150.

    Google Scholar 

  78. Y.L. Wang, G.L. Chen, J. Liu, and Z. Lai, The contact characterization of conductive particles in anisotropically conductive adhesive using FEM, Proc. 2nd IEEE International Symposium on Polymeric Electronics Packaging, Göteborg, Sweden, 1999, pp. 199–206.

    Google Scholar 

  79. X. Wang, Y.L. Wang, G.L. Chen, J. Liu, and Z. Lai, Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter, IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 21(2), pp. 248–251 (1998).

    Article  Google Scholar 

  80. A. Zribi, K. Persson, Z. Lai, J. Liu, Y. Kang, S. Yu, and M. Willander, Effect of the bump height on the reliability of ACA made joints for flip-chip electronic packaging, 2nd International ATW on Flip-Chip Technology, Braselton, GA, 1998.

    Google Scholar 

  81. Z. Lai, R.Y. Lai, K. Persson, and J. Liu, Effect of bump height on the reliability of ACA flip-chip joining with FR4 rigid and polyimide flexible substrate, Journal of Electronics Manufacturing, 8(3&4), pp. 217–224 (1998).

    Google Scholar 

  82. C.M.L. Wu, J. Liu, and N.H. Yeung, Reliability of ACF in flip-chip with various bump height, Soldering and Surface Mount Technology, 13/1, pp. 25–30 (2001).

    Google Scholar 

  83. T. Sugiyama, The latest bare chip bonding by ACF, Sony Chemicals, seminar documentation at Chalmers University of Technology, 2000.

    Google Scholar 

  84. M. Törnvall, Proceedings of a Swedish National Seminar on Environmentally Compatible Materials Research for Electronics Packaging, IVF.

    Google Scholar 

  85. J. Liu and R. Rörgren, Joining of displays using thermo-setting anisotropically conductive adhesive joints, Journal of Electronics Manufacturing, 3, pp. 205–214 (1993).

    Article  Google Scholar 

  86. A. Sihlbom, R. Sihlbom, and J. Liu, Thermal characterization of electrically conductive adhesive flip-chip joints, Proc. of the IEEE/CPMT Electronic Packaging Technology Conference, Dec. 8–10, Singapore, 1998, pp. 251–257.

    Google Scholar 

  87. A. Bauer and T. Gesang, Electrically conductive joints using Non-Conductive Adhesives (NCAs) in surface mount applications, in J. Liu, Ed., Chapter 12 of Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., UK, 1999, pp. 313–341.

    Google Scholar 

  88. C. Khoo, J. Liu, M. Ågren, and T. Hjertberg, Influence of curing on the electrical and mechanical reliability of conductive adhesive joints, Proc. 1996 IEPS Conference, Austin, Texas, 1996, pp. 483–501.

    Google Scholar 

  89. J. Liu, K. Gustafsson, Z. Lai, and C. Li, Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations, IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 20(1), pp. 21–30 (1997).

    Article  Google Scholar 

  90. J. Liu, P. Lundström, K. Gustafsson, and Z. Lai, Conductive adhesive joint reliability under full-cure conditions, EEP-Vol. 19-1, Advances in Electronics Packaging, Vol. 1, ASME 1997, pp. 193–199.

    Google Scholar 

  91. C. Khoo and J. Liu, Moisture sorption in some popular conductive adhesives, Circuit World, 22(4), pp. 9–15 (1996).

    Google Scholar 

  92. Q.K. Tong, D. Markley, G. Fredrickson, R. Kuder, and D. Lu, Conductive adhesives with stable contact resistance and superior impact performance, Proc. 49th Electronic Components and Technology Conference San Diego, 1999, pp. 347–352.

    Google Scholar 

  93. D. Lu and C.P. Wong, Development of conductive adhesives for solder replacement, IEEE Trans. Compon. Packag. Technol., 23(4), pp. 620–626 (2000).

    Article  MathSciNet  Google Scholar 

  94. H. Takezawa, T. Mitani, T. Kitae, H. Sogo, S. Kobayashi, and Y. Bessho, Effects of zinc on the reliability of conductive adhesives, Proc. 8th International Symposium on Advanced Packaging Materials, Braselton, GA, 2002, pp. 139–143.

    Google Scholar 

  95. O. Rusanen, Ph.D. dissertation, Adhesives in micromechanical sensor packaging, University of Oulu, VTT Publication 407, 2000.

    Google Scholar 

  96. O. Rusanen, Modeling of ICA creep properties, Proc. 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics), Espoo, Finland, 2000, pp. 194–198.

    Google Scholar 

  97. Z. Lai and J. Liu, Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates, IEEE Trans. Compon. Packag. Manuf. Technol., Part B: Advanced Packaging, 19(3), pp. 644–660 (1996).

    Article  Google Scholar 

  98. Z. Lai and J. Liu, The effects of bonding force on ACA flip-chip reliability, IMAPS ATW on Flip-Chip Technology, Braselton, 1999.

    Google Scholar 

  99. J. Liu, A. Tolvgård, J. Malmodin and Z. Lai, A reliable and environmentally friendly packaging technology—flip-chip joining using anisotropically conductive adhesive, IEEE Trans. Compon. Packag. Technol., 22(2), pp. 186–190 (1999).

    Article  Google Scholar 

  100. J. Liu and Z. Lai, Reliability of ACA flip-chip joints on FR-4 substrate, InterPACK’99, International, InterSociety, Electronic Packaging Technical/Business Conference and Exhibition, June 13–17, Hawaii, USA, Maui, 1999, pp. 1691–1697.

    Google Scholar 

  101. H. Westphal, Health and environmental aspects of conductive adhesives-the use of lead-based alloys compared with adhesives, in J. Liu, Ed., Chapter 18 of Conductive Adhesives for Electronic Packaging, Electrochemical Publications Ltd., UK, 1999, pp. 415–424.

    Google Scholar 

  102. T. Segerberg, Life Cycle Analysis—A comparison between conductive adhesives and lead containing solder for surface mount application, IVF report, 1997.

    Google Scholar 

  103. A. Tolvgård, J. Malmodin, J. Liu, and Z. Lai, A reliable and environmentally friendly packaging technology—flip chip joining using anisotropically conductive adhesive, Proc. 3rd International Conference on Adhesive Joining and Coating Technology in electronics Manufacturing, Binghamton, NY, 1998, pp. 19–26.

    Google Scholar 

  104. L. Li and J.E. Morris, An introduction to electrically conductive adhesives, Int. J. Microelectronic Packaging, 1(3), pp. 159–175 (1998).

    Google Scholar 

  105. J. Liu, Ed., Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., Port Erin, Isle of Man, UK, 1999, ISBN No. 0901150371.

    Google Scholar 

  106. G. Dou, D.C. Whalley, and C. Liu, Electrical conductive characteristics of ACA bonding: a review of the literature, current challenges and future prospects, Proc. 6th IEEE CPMT Confer. High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’04), Shanghai, 2004, pp. 264–276.

    Google Scholar 

  107. J. Liu and Z. Mo, Reliability of interconnects with conductive adhesives, in S. Dongkai, Ed., Lead-free Solder Interconnect Reliability, ASM, Materials Park, OH, 2005, pp. 249–276.

    Google Scholar 

  108. J.E. Morris and J. Liu, An Internet course on conductive adhesives for electronics packaging, Proc. 50th Electronic Components and Technology Conference, Las Vegas, May, 2000, pp. 1016–1020.

    Google Scholar 

  109. J. Liu and J.E. Morris, State of the art in electrically conductive adhesives, Workshop Polymeric Materials for Microelectronics and Photonics Applications, EEP-Vol. 27, ASME, 1999, pp. 259–281.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Electrical and Computer Engineering, Portland State University, Oregon, USA

    James E. Morris

  2. SMIT Center and Department of Microtechnology and Nanoscience, Chalmers University of Technology, Goteborg, Sweden

    Johan Liu

  3. SMIT Center, Shanghai University, China

    Johan Liu

Authors
  1. James E. Morris
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Johan Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

Editor information

Editors and Affiliations

  1. University of California, Santa Cruz, California, USA

    E. Suhir

  2. University of Maryland, College Park, Maryland, USA

    E. Suhir

  3. University of Colorado, Boulder, Colorado, USA

    Y. C. Lee

  4. Georgia Tech, Atlanta, Georgia, USA

    C. P. Wong

Rights and permissions

Reprints and permissions

Copyright information

© 2007 Springer Science+Business Media, LLC

About this chapter

Cite this chapter

E. Morris, J., Liu, J. (2007). Electrically Conductive Adhesives: A Research Status Review. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_40

Download citation

  • DOI: https://doi.org/10.1007/0-387-32989-7_40

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-27974-9

  • Online ISBN: 978-0-387-32989-5

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Search

Navigation