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Focused Ion Beam Gases for Deposition and Enhanced Etch

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Book cover Introduction to Focused Ion Beams

Abstract

The utility of a focused ion beam (FIB) to provide material removal for micromachining via sputtering with resolution of better than 10 nm has led to many important applications. In addition, FIB combined with a gas source containing the chemical precursors for deposition of materials or for enhanced, selective material removal provides the capabilities for a much wider range of micromachining applications. This chapter introduces FIB material deposition and chemically enhanced material removal processes, lists some of the FIB chemical precursors in common use and discusses the parameters for their use, and presents several examples.

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References

  • Abramo M, Hahn L, and Moszkowicz L, Proceedings of 20th International Symposium for Testing and Failure Analysis, ASM International, p. 439 (1994).

    Google Scholar 

  • Adams DP, Vasile MJ, Mayer TM, and Hodges VC, J. Vac. Sci. Technol. B21, 2334 (2003).

    Article  Google Scholar 

  • Bannerjee I and Livengood RH, J. Electrochem. Soc. 140, 183 (1993).

    Article  Google Scholar 

  • Campbell AN, Proceedings of 23rd International Symposium for Testing and Failure Analysis, ASM International, p. 223 (1997).

    Google Scholar 

  • Casey JD Jr., Doyle AF, Lee RG, Stewart DK, and Zimmermann H, Microelectronic Engineering 24, 43 (1994).

    Article  Google Scholar 

  • Casey JD Jr., et al., J. Vac. Sci. Technol. B20, 2682 (2002).

    Article  Google Scholar 

  • Edinger K, Melngailis J, and Orloff J, J. Vac. Sci. Technol. B16, 3311 (1998).

    Article  Google Scholar 

  • Giannuzzi LA, and Stevie FA, Micron 30, 197 (1999).

    Article  Google Scholar 

  • Gonzalez JC, Griffis DP, Miau TT, and Russell PE, J. Vac. Sci. Technol. B19, 2539 (2001).

    Article  Google Scholar 

  • Gonzalez JC, da Silva MIN, Griffis DP, and Russell PE, J. Vac. Sci. Technol. B20, 2700 (2002).

    Article  Google Scholar 

  • Harriott LR, J. Vac. Sci. Technol. B11, 2012 (1993).

    Article  Google Scholar 

  • Hoshino T, Watanabe K, Kometani R, Morita T, Kanda K, Haruyama Y, Kaito T, Fujita J Ishida M, Ochiai Y, and Matsui S, J. Vac. Sci. Technol. B21, 2732 (2003).

    Article  Google Scholar 

  • Ishitani T, et al., J. Vac. Sci. Technol. B9, 2633 (1991).

    Article  MathSciNet  Google Scholar 

  • Langfisher H, Basnar B, Hutter H, and Bertagnolli E, J. Vac. Sci. Technol. A20, 1408 (2002).

    Article  ADS  Google Scholar 

  • Li SX, Toyoshiba LO, Delenia E, and Kazmi S, Proceedings of 20th International Symposium for Testing and Failure Analysis, ASM International, p. 425 (1994).

    Google Scholar 

  • Matsui S, Kaito T, Fujita J, Kanda K, and Haruyama Y, J. Vac. Sci. Technol. B18, 3181 (2000).

    Article  Google Scholar 

  • Mohr J, and Oviedo R, Proceedings of 19th International Syposium for Testing and Failure Analysis, ASM International, p. 391 (1993).

    Google Scholar 

  • Morita T, et al., J. Vac. Sci. Technol. B21, 2737 (2003).

    Article  Google Scholar 

  • Overwijk MHF, and van den Heuvel FC, Nucl. Inst. Meth. Physics Research B80/81, 1324 (1993).

    Article  ADS  Google Scholar 

  • Phillips JR, Griffis DP, and Russell PE, J. Vac. Sci. Technol. 18, 1061 (2000).

    Article  ADS  Google Scholar 

  • Ratta ADD, Melngailis J, Thompson CV, J. Vac. Sci. Technol. B11, 2195 (1993).

    Article  Google Scholar 

  • Ro JS, Thompson CV, and Melngailis J, J. Vac. Sci. Technol. B12, 73 (1994).

    Article  Google Scholar 

  • Russell PE, Stark TJ, Griffis DP, Phillips JR, and Jarausch KF, J. Vac. Sci. Technol. B16, 2494 (1998).

    Article  Google Scholar 

  • Stark TJ, Shedd GM, Vitarelli J, Griffis DP, and Russell PE, J. Vac. Sci. Technol. B13, 2565 (1995).

    Article  Google Scholar 

  • Stark TJ, Griffis DP, and Russell PE, J. Vac. Sci. Technol. B14, 3990 (1996).

    Article  Google Scholar 

  • Telari KA, Rogers BR, Fang H, Shen L, Weller RA, and Braski DN, J. Vac. Sci. Technol. B20, 590 (2002).

    Article  Google Scholar 

  • Thaus DM, Stark TJ, Griffis DP, and Russell PE, J. Vac. Sci. Technol. B14, 3928 (1996).

    Article  Google Scholar 

  • Van Doorselaer K, Van den Reeck M, Van den Bempt L, Young R, and Whitney J, Proceedings of 19th International Symposium for Testing and Failure Analysis, ASM International p.405 (1993).

    Google Scholar 

  • Van Doorselaer K, and Van den Bempt L, Proceedings of 20th International Symposium for Testing and Failure Analysis, ASM International p. 397 (1994).

    Google Scholar 

  • Weiland R, et al., Proceedings of 26th International Symposium for Testing and Failure Analysis, ASM International, p. 393 (2000).

    Google Scholar 

  • Xu X and Melngailis J, J. Vac. Sci. Technol. B11, 2436 (1993).

    Article  Google Scholar 

  • Yaguchi T, Kamino T, Ishitani T, and Urao R, Microscopy and Microanalysis 5, 365 (1999).

    Article  ADS  Google Scholar 

  • Young RJ, Cleaver JRA, and Ahmed H, J. Vac. Sci. Technol. B11, 234 (1993).

    Article  Google Scholar 

  • Young RJ, and Puretz J, J. Vac. Sci. Technol. B13, 2576 (1995).

    Article  Google Scholar 

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Author information

Authors and Affiliations

  1. Analytical Instrumentation Facility, North Carolina State University, Raleigh, NC, 27695

    F. A. Stevie, D. P. Griffis & P. E. Russell

Authors
  1. F. A. Stevie
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  2. D. P. Griffis
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  3. P. E. Russell
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Editor information

Editors and Affiliations

  1. FEI Company, Hillsboro, USA

    Lucille A. Giannuzzi

  2. North Carolina State University, Raleigh, USA

    Fred A. Stevie

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© 2005 Springer Science+Business Media, Inc.

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Stevie, F.A., Griffis, D.P., Russell, P.E. (2005). Focused Ion Beam Gases for Deposition and Enhanced Etch. In: Giannuzzi, L.A., Stevie, F.A. (eds) Introduction to Focused Ion Beams. Springer, Boston, MA. https://doi.org/10.1007/0-387-23313-X_3

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