Abstract
A FIB micro-sampling technique has been developed to facilitate TEM specimen preparation while allowing samples to remain intact. A deep trench is FIB-milled to remove a portion of the sample containing the region of interest. A micromanipulator is employed for the purpose of lifting out a small portion of the sample, i.e., the micro-sample. FIB assisted metal deposition is used to bond the micro-sample to the micromanipulator. The micro-sample is subsequently lifted out and mounted onto an edge of the micro-sample carrier using FIB assisted metal deposition. The micro-sample is then thinned to the thickness of about 0.1µm for TEM observation. All of the above steps are accomplished under vacuum in the same FIB system. This procedure is a reliable TEM specimen preparation technique when the evaluation or failure analysis of a specific site is required. Both cross sectional and plan view TEM specimen preparations are feasible with this technique. In addition, a technique to prepare TEM specimens from a specific site has also been developed. In this technique, an FIB system equipped with a FIB/TEM(STEM) compatible specimen holder is used for thinning of the samples, e.g., a micro-sample. The compatible specimen holder permits repeated alternating FIB milling and TEM(STEM) observation, enabling TEM specimen preparation from a specific site.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Basile, DP, Boylan R, Baker B, Hayes K, Soza D, “FIBXTEM — Focused ion beam milling for TEM sample preparation”, In: Anderson, R., Tracy, R., Bravman, B. (Eds.). Materials Research Society Symposium Proceedings, 254. MRS, Pittsburgh, pp. 23–41 (1992).
Bender H, Roussel P, Cross-sectional transmission electron microscopy and focused ion beam study of advanced silicon devices. In: Inst. Phys. Conf. Ser. Proc. Microscopy of Semiconducting Materials X. (1997).
Giannuzzi LA, Drown JL, Brown SR, Irwin RB, Stevie FA, “Specimen preparation for Transmission Electron Microscopy of Materials”, Mater. Res. Soc. Symp. Proc. Vol.480: 19 (1997).
Giannuzzi LA, Drown JL, Brown SR, Irwin RB, Stevie FA, “Applications of the FIB lift-out technique for TEM specimen preparation”, Microsc. Res. Tech. 41:285–290 (1998).
Giannuzzi LA, Prenitzer BI, Drown-Macdonald JL, Brown SR, Irwin RB, Stevie FA, Shofner TL, “Advances in the FIB lift-out technique for TEM specimen preparation: HREM lattice imaging”. Microstructural Science 26:26–29 (1998).
Kirk ECG, Williams DA, Ahmed H, “Cross-sectional transmission electron microscopy of precisely selected regions from semiconductor devices”, Inst. Phys. Ser. 100, 501–506 (1989).
Kitano Y, Fujikawa Y, Kamino T, Yaguchi T, Saka H, “TEM observation of micrometer-sized Ni powder Particles thinned by FIB cutting technique”, J. Electron Microsc. 44, 410–413 (1995).
Kitano Y, Fujikawa Y, Takeshita H, Kamino T, Yaguchi T, Matsumoto H, Koike H, “TEM observation of micrometer-sized Ni powder particles thinned by FIB cutting technique”, J. Electron Microsc. 44,376–383 (1995).
Overwijk MHF, van den Heuvel FC, Bulle-Lieuwma CWT, “Novel scheme for the preparation of transmission electron microscopy specimens with a focused ion beam”, J. Vac. Sci. Technol. B 11(6), 2021–2024 (1993).
Park K, “Cross-sectional TEM specimen preparation of semiconductor devices by focused ion beam etching”, In: Anderson, R. (Ed.), Materials Research Society Symposium Proceedings, MRS, Pittsburgh, 199, pp. 271–280 (1990).
Stevie FA, Irwin RB, Shofner TL, Brown SR, Drown JL, Giannuzzi LA, “Plan view TEM sample preparation using the focused ion beam technique”, Proc. Int. Conf. American Institute. of Physics, Gaithersburg (Woodbury, New York), Chap.449: 868–871 (1998).
Yaguchi T, Matsumoto H, Kamino T, Ishitani T and Urao R, “A method for cross sectional thin specimen preparation from specific site using combination of focused ion beam system and intermediate voltage electron microscope and its application to the characterization of a precipitate in a steel”, Microscopy and Microanalysis 7 (1998).
Yaguchi T, Kamino T, Ishitani T and Urao R, “Method for cross sectional TEM specimen preparation of composite materials using a dedicated FIB system”, Microscopy and Microanalysis 5: 363–370 (1999).
Yaguchi T, Kamino T, Sasaki M, Barbezat G and Urao R, “Cross sectional specimen preparation and observation of a plasma sprayed coating using an FIB/TEM system,” Microscopy and Microanalysis 6: 218–223 (2000).
Young RJ, Kirk ECG, Williams DA, Ahmed H, “Fabrication of planar and cross-sectional TEM specimens using a focused ion beam”, In: Anderson, R. (ed.), Material Research Society Symposium Proceedings, MRS Pittsburgh, 199, pp. 205–216 (1990).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2005 Springer Science+Business Media, Inc.
About this chapter
Cite this chapter
Kamino, T., Yaguchi, T., Hashimoto, T., Ohnishi, T., Umemura, K. (2005). A FIB Micro-Sampling Technique and a Site Specific TEM Specimen Preparation Method. In: Giannuzzi, L.A., Stevie, F.A. (eds) Introduction to Focused Ion Beams. Springer, Boston, MA. https://doi.org/10.1007/0-387-23313-X_11
Download citation
DOI: https://doi.org/10.1007/0-387-23313-X_11
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-23116-7
Online ISBN: 978-0-387-23313-0
eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)