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Interconnect Modeling in Circuit Simulation

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Interconnection Noise in VLSI Circuits
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References

  1. Ramo S., Whinnery J. R., and Van Duzer T. Fields and Waves in Communication Electronics. Wiley and Sons, 2nd edition, 1984.

    Google Scholar 

  2. Collin R. E. Field theory of guided waves. IEEE Press, 2nd edition, 1991.

    Google Scholar 

  3. Montgomery C. G., Dicke R. H., and Pureell E. M., editors. Principles of microwave circuits. Dover, 1965.

    Google Scholar 

  4. Mesa F. L., Cano G., Medina F., Marques R., and Horno M. “On the Quasi-TEM and Full-Wave Approaches Applied to Coplanar Multistrip on Lossy Dielectric Layered Media”. IEEE Trans. on Microwave Theory and Techniques, 40(3), March 1992.

    Google Scholar 

  5. Matthaei G. L., Shu J. C.-H., and Long S. I. “Simplified Calculation of Wave-Coupling Between Lines in High-Speed Integrated Circuits”. IEEE Trans. on Circuits and Systems, 37(10), October 1990.

    Google Scholar 

  6. Brews J. R. “Transmission Line Models for Lossy Waveguide Interconnections in VLSI”. IEEE Trans. on Electron Devices, 33(9), September 1986.

    Google Scholar 

  7. Horno M., Mesa F.L., Medina F., and Marques R. “Quasi-TEM analysis of multilayered, multiconductor coplanar structures with dielectric and magnetic anisotropy including substrate losses”. IEEE Trans. on Microwave Theory and Techniques, 38(8), August 1990.

    Google Scholar 

  8. DeFalco J. A. “Reflection and Crosstalk in Logic Circuit Interconnections”. IEEE Spectrum, 7(7), July 1970.

    Google Scholar 

  9. Ethirajan K. and Nemec J. “Termination techniques for high-speed buses”. EDN Magazine, February 1998.

    Google Scholar 

  10. Ho C. W., Chance D. A., Bajorek C. H., and Acosta R. E. “The Thin-Film Module as a High-Performance Semiconductor Package”. IBM J. Res. and Develop., 26(3), May 1982.

    Google Scholar 

  11. Watts R.K., editor. Submicron Integrated Circuits, chapter 6, pages 269_331. John Wiley & Sons, 1989.

    Google Scholar 

  12. Achar R. and Nakhla M.S. “Simulation of high-speed interconnects”. Proceedings of the IEEE, 89(5), May 2001.

    Google Scholar 

  13. Kuznetsov D. B. and Schutt-Aine J.E. “Optimal transient simulation of transmission lines”. IEEE Tran. on Circuits and Systems_I, 43(2), February 1996.

    Google Scholar 

  14. Odabasogliu A., Celik M., and Pileggi L.T. “PRIMA: Passive reduced-order interconnect macromodeling algorithm”. IEEE Trans. on Computer Aided Design of Integrated Circuits, 17(8), August 1998.

    Google Scholar 

  15. Avant! Corp. Star-Hspice 2001.2, June 2001.

    Google Scholar 

  16. Kamon M., Tsuk M.J., and White J. “Fasthenry: a multipole-accelerated 3-D inductance extraction program”. IEEE Trans. on Microwave Theory and Techniques, 42(9), September 1994.

    Google Scholar 

  17. Moll F., Roca M., and Rubio A. “Inductance in VLSI interconnection modelling”. IEE Proc.-Circuits, Devices and Systems, 145(3), June 1998.

    Google Scholar 

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© 2004 Springer Science + Business Media, Inc.

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(2004). Interconnect Modeling in Circuit Simulation. In: Interconnection Noise in VLSI Circuits. Springer, Boston, MA. https://doi.org/10.1007/0-306-48719-5_2

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  • DOI: https://doi.org/10.1007/0-306-48719-5_2

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4020-7733-3

  • Online ISBN: 978-0-306-48719-4

  • eBook Packages: Springer Book Archive

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