Abstract
The electromagnetic compatibility became a major concern for integrated circuits during the last years. As the operating frequency has increased and the supply voltage has become lower, the electromagnetic emission as well as the susceptibility of integrated circuits increased tremendously. Generally speaking, electromagnetic compatibility is defined as the ability of an electrical system to work properly in its electromagnetic environment without unduly interfering with this environment. This is the reason why electromagnetic compatibility is of importance to all of us. Consider, for example, the omnipresent electromagnetic environment in our motor vehicles generated by devices like ABS braking systems, airbag sensors, or the motor management. Without a proper design, electromagnetic compatibility of integrated circuits will become a limiting factor for the performance of every advanced electronic system.
In this paper, the new standards to characterize the electromagnetic compatibility of integrated circuits will be presented. These standards provide measurement methods to characterize the electromagnetic emission and the immunity of integrated circuits. It will be shown how two measurement methods have been used to find the source of the unwanted electromagnetic emission of an integrated circuit.
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References
IEC 61967-1: “Integrated circuits-Measurement of electromagnetic emissions, 150kHz to 1GHz-Part 1: General conditions and definitions”, 47A/632/FDIS
IEC 62132-1: “Integrated circuits-Measurement of electromagnetic immunity, 150 kHz to 1GHz-Part 1: General and definitions”, 47A/618/CD
B. Deutschmann, G. Winkler, R. Jungreithmair, „EMV-Charaktcrisierung von ICs“ Test Kompendium 2003, pp 35–37, ISBN 3-934698-08-5
IEC 61967-2: “Integrated circuits-Measurement of electromagnetic emissions, 150kHz to 1GHz-Part 2: TEM-cell method and wideband TEM-cell method (150kHz to 8GHz)”, 47A/619/NP, New Work Item Proposal, Date of proposal: Jul. 2001
IEC 62132-2: “Integrated circuits-Measurement of radiated immunity-Part 2: TEM cell method” (to be proposed)”
IEC 61967-3: “Integrated circuits-Measurement of electromagnetic emissions, 150kHz to 1GHz-Part 3: Measurement of radiated emissions, surface scan method (10kHz to 3GHz)”, 47A/620/NP, New Work Item Proposal, Date of proposal: Jul. 2001
IEC 61967-4, “Integrated Circuits, Measurement of Electromagnetic Emissions, 150kHz to 1GHz Measurement of Conducted Emission, 1Ohm/1500hm Method”, 47A/606/CDV, 2001-04-13
B. Deutschmann, G. Winkler, R. Jungreithmair, „Measuring the Electromagnetic Emissions of Integrated Circuits with IEC 61967-4 (The Measuring Method and its Weaknesses)”, IEEE International Symposium on Electromagnetic Compatibility, ISBN 0-7803-7264-6/02, August 2002, pp 407–412
IEC 61967-5: “Integrated circuits, Measurement of electromagnetic emissions, 150kHz to 1GHz-Part 5: Measurement of conducted emissions, Workbench faraday cage method”, 47A/615/CDV, 2001-05-18
IEC 62132-5: “Integrated circuits, Measurement of electromagnetic immunity-Part 5: Measurement of conducted immunity-Workbench Faraday cage method”, 47A/542/NP, 2002-03-08
IEC 61967-6: “IEC 61967-6: Integrated circuits, Measurement of Electromagnetic Emissions, 150kHz-1GHz Part 6: Measurement of conducted emissions, Magnetic probe method”, 47A/608/CDV, Committee Draft For Vote, Date of circulation 2000-11-10
IEC 62132-3: “Integrated circuits-Measurement of radiated immunity-Part 3: Bulk current injection method”, 47A/624/NP, 2001-12-07
IEC 62132-4: “Integrated circuits-Measurement of radiated immunity-Part 4: Direct RF power injection method”, 47A/625/NP, 2001-12-07
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© 2003 Kluwer Academic Publishers
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Deutschmann, B. (2003). Improvement of System Robustness Through EMC Optimization. In: van Roermund, A., Steyaert, M., Huijsing, J.H. (eds) Analog Circuit Design. Springer, Boston, MA. https://doi.org/10.1007/0-306-48707-1_10
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DOI: https://doi.org/10.1007/0-306-48707-1_10
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4020-7559-9
Online ISBN: 978-0-306-48707-1
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