Skip to main content

Lumped Modeling of Dissipative Processes

  • Chapter
  • 3707 Accesses

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   84.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD   159.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Related Reading

  • H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, Second Edition, New York: Oxford University Press, 1959, reprinted in 1986.

    Google Scholar 

  • J. Crank, The Mathematics of Diffusion, Second Edition, Oxford: Clarendon Press, 1975.

    Google Scholar 

Download references

Rights and permissions

Reprints and permissions

Copyright information

© 2002 Kluwer Academic Publishers

About this chapter

Cite this chapter

(2002). Lumped Modeling of Dissipative Processes. In: Microsystem Design. Springer, Boston, MA. https://doi.org/10.1007/0-306-47601-0_12

Download citation

  • DOI: https://doi.org/10.1007/0-306-47601-0_12

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-7923-7246-2

  • Online ISBN: 978-0-306-47601-3

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics