This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
Further Readings
Djokić S.S. Cementation of Copper onto Aluminum in Alkaline Solutions. J. Electrochem. Soc. 1996; 143:1300–1305
Mallory G.O., Hajdu J.B., eds. Electroless Plating: Fundamentals and Applications Orlando, Florida: AESFS, 1990.
Gawrilov G.G., Chemical (Electroless) Nickel Plating, Surrey, U.K.: Portcullis Press Limited, 1979.
Chassaing E., Cherakaoni M., Srhiri A. Electrochemical Investigation of the Autocatalytic Deposition of Ni-Cu-P Alloys. J. Appl. Electrochem., 1993; 23:1169–1174.
Gorbunova K.M., Ivanov M.V, Moiseev V.P. Electroless Deposition of Nickel Boron Alloys. J. Electrochem. Soc., 1993; 120:613–618.
F. Pearlstein F, Weightman R.F. Electroless Cobalt Deposition from Acid Bath. J. Electrochem. Soc., 1974; 121:1023–1028.
Dumesic J., Koutsky J.A., Champan T.W. The Rate of Electroless Copper Deposition by Formaldehyde Reduction. J. Electrochem. Soc, 1974; 121:1405–1411.
Saranov E.I, Bulatov K.N., Lundin A.B. Deposition of Thin Cobalt Coatings by Autocatalytic Reduction of Its Salts with Formaldehyde, Zashch. Metall., 1970; 6:612–614.
Djokić S.S. Electroless Deposition of Cobalt Using Hydrazine as a Reducing Agent. J. Electrochem. Soc., 1997; 144:2358–2363.
Lukes M. The mechanism for the Autocatalytic Reduction of Nickel by Hypophosphite Ion. Plating, 1964; 51:969–971.
Ivanovskaya, T.V., Gorbunova K.M. On the Mechanism of Catalytic reduction of Metals by Hypophosphite. Zashch. Metall., 1966; 2:477–481.
Paunovic M, Electrochemical Aspects of Electroless Deposition of Metals. Plating, (1968); 51:1161–1167.
Donahue F.M. Interactions in Mixed Potential Systems. J. Electrochem. Soc. 1972; 119:72–74.
Salvago G, Cavallotti P. Characteristics of the Reduction of Nickel Alloys with Hypophosphite. Plating. 1972; 59(7):665–671.
van den Meerakker J.E.A.M. On the Mechanism of Electroless Plating. II One Mechanism for Different Reactions. J. Appl. Electrochem. 1981; 11:395–400.
Okinaka Y, Osaka T. “Electroless Deposition Processes: Fundamentals and Applications” In Advances in Electrochemical Science and Engineering, Gerischer H. and Tobias C., eds., p.55–116, New York: VCH Publishers Inc., 1994.
Kato M., Yazawa Y., Okinaka Y., Proceedings of AESF SUR/FIN’95, Annual Technical Conference Electroless Gold Plating Bath Using Ascorbic Acid as Reducing Agent-Recent Improvements. pp. 805–813, 1995 June 26–29; Baltimore, MD: AESFS Orlando, FL, 1995.
Kato M., Yazawa Y., Hoshino S. Electroless Gold Plating Solution. USA Patent (1995); 5,470,381.
Wachi H, Otani Y. Electroless Gold Plating Solution. USA Patent (1997); 5,660,619.
Wachi H, Otani Y. Electroless Gold Plating Solution. USA Patent (1996); 5,560,764.
Rutkevich D.L., Shevchenko G.P., Svirido N.V., Osipovich N.P. Electrochemical Study of Autocatalytic Bismuth (III) Reduction with Ti(III)-Complexes., J. Electrochem. Soc. 1993; 140:3473–3478.
Rights and permissions
Copyright information
© 2002 Kluwer Academic Publishers
About this chapter
Cite this chapter
(2002). Metal Deposition without an External Current. In: Fundamental Aspects of Electrometallurgy. Springer, Boston, MA. https://doi.org/10.1007/0-306-47564-2_10
Download citation
DOI: https://doi.org/10.1007/0-306-47564-2_10
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-306-47269-5
Online ISBN: 978-0-306-47564-1
eBook Packages: Springer Book Archive