Advertisement

Thermal Simulation for VLSI Systems

Chapter
  • 112 Downloads

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. [1]
    M. N. Qzisik, Boundary Value Problems of Heat Conduction. New York, NY: Dover, 1968.Google Scholar
  2. [2]
    Y. K. Cheng, Electrothermal Simulation and Temperature-sensitive Reliability Diagnosis for CMOS VLSI Circuits. PhD thesis, Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 1997.Google Scholar
  3. [3]
    Y. K. Cheng and S. M. Kang, “An efficient method for hot-spot identification in ULSI circuits,” in Proceedings of the ACM/IEEE International Conference on Computer-Aided Design, pp. 124–127, Nov. 1999.Google Scholar
  4. [4]
    V. Dwyer, A. Franklin, and D. Campbell, “Thermal failure in semiconductor devices,” Solid-State Electronics, vol. 33, pp. 553–560, May 1990.Google Scholar
  5. [5]
    K. Fukahori and P. R. Gray, “Computer simulation of integrated circuits in the presence of electrothermal interaction,” IEEE Journal of Solid-State Circuits, vol. 1I, pp. 834–846, Dec. 1976.Google Scholar
  6. [6]
    Y. K. Cheng, P. Raha., C. C. Teng, E. Rosenbaum, and S. M. Kang, “ILLIADS-T: An electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 17, pp. 668–681, Aug. 1998.Google Scholar
  7. [7]
    G. Digele, S. Lindenkreuz, and E. Kasper, “Fully coupled dynamic electrothermal simultion.” IEEE Transactions on VLSI Systems, vol. 5, pp. 250–257, Sept. 1997.Google Scholar
  8. [8]
    W. K. Chu and W. H. Kao, “A three-dimensional transient electrothermal simulation system for IC’s,” in Proceedings of the THERMINIC Workshop, pp. 201–207, Sept. 1995.Google Scholar
  9. [9]
    V. A. M. N. Sabry, A. Bontemps and R. Vahrmann, “Realistic and efficient simulation of electro-thermal effects in VLSI circuits,” IEEE Transactions on VLSI Systems, vol. 5, pp. 283–289, Sept. 1997.Google Scholar
  10. [10]
    C. C. S. Wunsche and P. Schwarz, “Electro-thermal circuit simulation using simulator coupling,” IEEE Transactions on VLSI Systems, vol. 5, pp. 277–282, Sept. 1997.Google Scholar
  11. [11]
    B. D. J. P. Fradin. “Automatic computation of conductive conductances intervening in the thermal chain,” in Proceedings of the International Conference on Environmental Systems, July 1995.Google Scholar
  12. [12]
    J. F. Thompson, Z. Warsi, and C. W. Mastin, Numerical Grid Generation. New York, NY: North-Holland, 1985.Google Scholar
  13. [13]
    J. W. Brown and R. V. Churchill, Fourier Series and Boundary Value Problems. New York, NY: McGraw-Hill, 1993.Google Scholar
  14. [14]
    D. G. Zill, Differential Equations with Boundary-Value Problems. Prindle, Weber & Schmidt, 1986.Google Scholar
  15. [15]
    W. F Ames, Nonlinear Partial Differential Equations in Engineering. Academic Press, New York, 1965.Google Scholar
  16. [16]
    J. N. Funk, M. P. Menguc, K. A. Tagavi, and C. J. Cremers, “A semianalytical method to predict printed circuit board package temperatures,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, pp. 675–684, Oct. 1992.Google Scholar
  17. [17]
    V. Koval, I. W. Farmaga, A. J. Strojwas, and S. W. Director, “MONSTR: A complete thermal simulator of electronic systems,” in Proceedings of the ACM/IEEE Design Automation Conference, pp. 570–575, June 1994.Google Scholar

Copyright information

© Kluwer Academic Publishers 2002

Personalised recommendations