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Ultrasonic Vibration Assisted Cutting of Tungsten Carbide

  • Kiu LiuEmail author
  • Hao Wang
  • Xinquan Zhang
Chapter
Part of the Springer Series in Advanced Manufacturing book series (SSAM)

Abstract

In this chapter, ultrasonic vibration assisted cutting is conducted to investigate the effect of various cutting conditions such as vibration mode and amplitude, diamond type, cutting speed, feed rate and depth of cut, on ductile mode cutting of tungsten carbide such as critical depth of cut, cutting force, chip formation, tool wear and surface integrity. Cutting forces are measured using a three-component dynamometer, critical depth of cut is measured using a stylus profilometer, machined surface integrity and chip formation are examined using an SEM, and tool wear is examined using an OMIS. It is found that critical depth of cut for the transition from ductile mode cutting to brittle mode cutting in 1D ultrasonic vibration assisted grooving is several times larger than that in the conventional grooving. Lower thrust directional amplitude in 2D ultrasonic vibration leads to less brittle fracture generated on the machined surface of tungsten carbide, and 1D ultrasonic vibration with no thrust directional vibration leads to minimum brittle fracture and less diamond tool wear. Nano-polycrystalline diamond with isotropic mechanical properties does not perform better than single crystal diamond as tool material in terms of tool flank wear in ultrasonic vibration assisted turning of tungsten carbide. Radial cutting force Fx is much larger than tangential cutting force Fz and axial cutting force Fy. Cutting speed has no significant effect on ductile chip formation mode. Ductile mode cutting is achieved when maximum undeformed chip thickness is smaller than a critical value. And the larger critical depth of cut for 1D ultrasonic vibration assisted grooving of tungsten carbide implies that ultrasonic vibration could be used to improve ductile mode cutting performance of brittle material.

References

  1. 1.
    Liu K (2002) Ductile cutting for rapid prototyping of tungsten carbide tools. NUS Ph.D. thesis, SingaporeGoogle Scholar
  2. 2.
    Liu K, Li XP (2001) Ductile cutting of tungsten carbide. J Mater Process Technol 113:348–354CrossRefGoogle Scholar
  3. 3.
    Liu K, Li XP (2001) Modelling of ductile cutting of tungsten carbide. T NAMRI/SME 29:251–258Google Scholar
  4. 4.
    Liu K, Li XP, Rahman M et al (2003) CBN tool wear in ductile cutting of tungsten carbide. Wear 255:1344–1351CrossRefGoogle Scholar
  5. 5.
    Moriwaki T, Shamoto E, Inoue K (1992) Ultraprecision ductile cutting of glass by applying ultrasonic vibration. CIRP Ann 41:141–144CrossRefGoogle Scholar
  6. 6.
    Kim JD, Choi IH (1997) Micro surface phenomenon of ductile cutting in the ultrasonic vibration cutting of optical plastics. J Mater Process Technol 68:89–98CrossRefGoogle Scholar
  7. 7.
    Kim JD, Choi IH (1998) Characteristics of chip generation by ultrasonic vibration cutting with extremely low cutting velocity. Int J Adv Manuf Technol 14:2–6CrossRefGoogle Scholar
  8. 8.
    Nerubai MS (1987) Characteristics of contact interaction in ultrasonic cutting of difficult-to-machine materials. Sov J Fri Wear 8:452–458Google Scholar
  9. 9.
    Lucas M, Graham G, Smith AC (1996) Enhanced vibration control of an ultrasonic cutting process. Ultrasonics 34:205–211CrossRefGoogle Scholar
  10. 10.
    Astashev VK, Babitsky VI (1998) Ultrasonic cutting as a nonlinear (vibro-impact) Process. Ultrasonics 36:89–96CrossRefGoogle Scholar
  11. 11.
    Moriwaki T, Shamoto E (1995) Ultrasonic elliptical vibration cutting. CIRP Ann 44:31–34CrossRefGoogle Scholar
  12. 12.
    Smith A, Nurse A, Graham G et al (1996) Ultrasonic cutting—a fracture mechanics model. Ultrasonics 34:197–203CrossRefGoogle Scholar
  13. 13.
    Liu K, Li XP, Rahman M et al (2004) Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance. Int J Adv Manuf Technol 24:389–394CrossRefGoogle Scholar
  14. 14.
    Liu K, Li XP, Rahman M et al (2007) A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers. Int J Adv Manuf Technol 32:631–637CrossRefGoogle Scholar
  15. 15.
    Zhang XQ, Huang R, Liu K et al (2018) Suppression of diamond tool wear in machining of tungsten carbide by combining ultrasonic vibration and electrochemical processing. Cera Int 44:4142–4153CrossRefGoogle Scholar
  16. 16.
    Rozenberg LD, Kazantsev VF, Makarov LO et al (1964) Ultrasonic cutting (English ed. by Balamuth L). Consultants Bureau Enterprises, New York, pp 4–55Google Scholar
  17. 17.
    Liu K, Li XP, Rahman M (2008) Characteristics of ultrasonic vibration assisted ductile cutting of tungsten carbide. Int J Adv Manuf Technol 35:833–841CrossRefGoogle Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2020

Authors and Affiliations

  1. 1.Singapore Institute of Manufacturing TechnologySingaporeSingapore
  2. 2.Department of Mechanical EngineeringNational University of SingaporeSingaporeSingapore
  3. 3.School of Mechanical EngineeringShanghai Jiao Tong UniversityShanghaiChina

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