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Ultrasonic Vibration Assisted Ductile Mode Cutting

  • Kiu LiuEmail author
  • Hao Wang
  • Xinquan Zhang
Chapter
Part of the Springer Series in Advanced Manufacturing book series (SSAM)

Abstract

It has been well known that ultrasonic vibration assisted cutting (UVC) is able to improve the machining performance for various material removal processes. For machining of brittle material, UVC has also been proven useful in improving surface integrity and increasing tool life by significantly increasing critical undeformed chip thickness for ductile-to-brittle transition. This chapter presents an analytical model to predict critical undeformed chip thickness in UVC of brittle material, based on the variation of specific cutting energy for prediction of ductile-to-brittle transition in nano-machining. Vibration parameters are taken into consideration in addition to work material intrinsic properties, tool geometry and machining parameters in predicting critical undeformed chip thickness. A series of cutting tests on single crystal silicon workpiece, using a single crystal diamond tool with different nominal cutting speeds, are conducted to verify the proposed theoretical model.

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Copyright information

© Springer Nature Singapore Pte Ltd. 2020

Authors and Affiliations

  1. 1.Singapore Institute of Manufacturing TechnologySingaporeSingapore
  2. 2.Department of Mechanical EngineeringNational University of SingaporeSingaporeSingapore
  3. 3.School of Mechanical EngineeringShanghai Jiao Tong UniversityShanghaiChina

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