Structure Design of a Fully Enclosed Airborne Reinforcement Computer

  • Jiang Feng HuangEmail author
Conference paper
Part of the Communications in Computer and Information Science book series (CCIS, volume 1146)


The Structure design method of a fully enclosed airborne reinforcement computer is discussed and the design scheme is introduced. The chassis structure, thermal design, electromagnetic compatibility and anti-vibration design of the case are emphatically introduced, and corresponding technical solutions and main structural diagrams are given for key technical problems. The fully enclosed computer mentioned in this paper has been applied in engineering and has well anti harsh environmental performance.


Structure design Airborne reinforcement computer Thermal design EMC design Anti harsh environment 


  1. 1.
    Zhang, Yu.: Experimental study on thermal design of sealed electronic enclosure. Electro-Mech. Eng. 31, 5–8 (2015)Google Scholar
  2. 2.
    Zhao, T., Zhang, J., Lin, P.: Optimization of low-noise airflow field of laptop’s thermal system. Noise Vib. Control 34, 47–51 (2014)Google Scholar
  3. 3.
    Huang, F., Chen, Y.-J.: Thermal design for the processor in a certain type of electronic equipment. Mech. Res. Appl. 29, 139–141 (2016)Google Scholar
  4. 4.
    Sha, C., You, Y., Hu, C., et al.: A thermal design for high density storage servers. Computer Engineering & Science. 37, 2228–2231 (2015)Google Scholar
  5. 5.
    Zhao, B.: Comparative study on heat dissipation performance of liquid cooling and air cooling technology of airborne chassis. Mech. Res. Appl. 28, 10–11 (2015)Google Scholar
  6. 6.
    People’s Republic of China National Military Standard: Reliability Prediction Handbook for Electronic Equipment. Military Standard Publishing and Issuing Department, Beijing (2006)Google Scholar
  7. 7.
    Liu, J.: Study on cooling structure of sealed case of a radar. Electro-Mech. Eng. 28, 36–38 (2012)Google Scholar
  8. 8.
    Tian, J., Wei, J., Zhao, B.: Electromagnetic compatibility design of the printed circuit board of airborne electronic equipment. Electron. Des. Eng. 22, 137–140 (2014)Google Scholar
  9. 9.
    Liu, Y.: Design of communication equipment cabinet with electromagnetic compatibility. J. Hebei Acad. Sci. 33, 35–38 (2016)Google Scholar
  10. 10.
    Yang, L., Zhao, G., Dong, W., et al.: Sealed design of avionic device. Mech. Eng. 5, 214–215 (2014)Google Scholar
  11. 11.
    Yuan, L., Huang, J.: The structure and defense design of a portable reinforcement machine. Mod. Manuf. Eng. 7, 123–125 (2012)Google Scholar
  12. 12.
    Li, K., Yang, L., Pang, W., et al.: Structural design and dynamics simulation for anti-adverse circumstance cabinet. Mach. Des. Manuf. 9, 35–37 (2012)Google Scholar
  13. 13.
    Shi, R., Li, P., Shi, G.: Mechanical analysis of some rocket-borne reinforced computer based on ANSYS. J. Shanghai Univ. Eng. Sci. 29, 342–346 (2015)Google Scholar
  14. 14.
    Luo, X.: Experimental study on acoustic noise of the forced air cooling reggedized computer. Dev. Innov. Mach. Electr. Prod. 29, 10–11 (2016)Google Scholar
  15. 15.
    Xian, F., Liu, J., Yi, Y., et al.: Protection and coating technology of PCBA in electronic assembly field. Electron. Process Technol. 36, 278–280 (2015)Google Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.The Computer DepartmentJiangsu Automation Research InstituteLianyungangChina

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