Numerical Analysis and Experimental Study on Heat Dissipation Performance of Sealed Rugged Server

  • Miao ZhangEmail author
  • Fuge Wang
Conference paper
Part of the Communications in Computer and Information Science book series (CCIS, volume 1146)


With the rapid development of computer technology, the power density of the rugged server is getting larger and larger, so it must be reasonably designed to ensure that the temperature of the server is properly controlled within the scope. This paper introduces the structure of the rugged server and selects the appropriate fan through theoretical analysis and calculation. Based on Icepak thermal simulation software, the rugged server is simulated and optimized, getting the steady temperature field and the velocity field inside the server. The product prototype is tested at a high temperature of 55 °C. The test results show the scheme of thermal design is feasible. The working temperature meets the derating design requirements, and the reliability of the equipment is improved. The simulation results of the paper can provide calculation methods and reference for the thermal design of sealed rugged servers.


Sealed rugged server Numerical analysis Thermal design Thermal test 


  1. 1.
    Li, L., Lin, J.: Simulation analysis of thermal runaway of sealed chassis based on ANSYS icepak. Electro-optic Technol. Appl. 27(6), 75–79 (2012)Google Scholar
  2. 2.
    Sun, Y.: Application of icepak in thermal design for rugged computer. Comput. Technol. Dev. 23(3), 215–222 (2013)Google Scholar
  3. 3.
    Zhou, J.: Study on thermal analysis method of closed electronic systems. Comput. Simul. 29(11), 416–419 (2012)Google Scholar
  4. 4.
    Song, H., Bin, H.: Application of thermal simulation in the structural design of electronic system. Appl. Sci. Technol. 28(8), 4–6 (2001)Google Scholar
  5. 5.
    Liu, M., Dong, Q., Chen, S.: Investigation on thermal design for opening cabinet of electronic equipment by numerical simulation. J. Air Force Eng. Univ. (Nat. Sci. Edn.) 6(4), 62–65 (2005)Google Scholar
  6. 6.
    Wang, F.: Computational Fluid Dynamics Analysis-CFD Software Theory and Applications. Tsinghua University Press, Beijing (2004)Google Scholar
  7. 7.
    Tao, W.: Numerical Heat Transfer, 2nd edn, pp. 1–8, 332–356. Xi’an Jiaotong University Press, Xi’an (2004)Google Scholar
  8. 8.
    Yu, J.: Electronic Equipment Thermal Design and Analysis Techniques, 2nd edn, pp. 50–120. Beijing University of Aeronautics and Astronautics Press, Beijing (2008)Google Scholar
  9. 9.
    Qiu, C., Zhao, D., Jiang, Q., et al.: Electronic Device Structure Design Principles, pp. 127–128. Southeast University Press, Nanjing (2007)Google Scholar
  10. 10.
    Li, F., Zhang, Y., Shen, X., Hao, Y.: Application and research of fan in rugged computer. Comput. Eng. Des. 34(9), 3307–3326 (2013)Google Scholar
  11. 11.
    GJB/Z 27-92. Reliability of Electronic Equipment Thermal Design Manual[S]Google Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.The Computer DepartmentJiangsu Automation Research InstituteLianyungangChina

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