Anti-vibration Performance and Electromagnetic Compatibility Design for the Shipborne Reinforced Computer

  • Guangle QinEmail author
Conference paper
Part of the Communications in Computer and Information Science book series (CCIS, volume 1146)


The ability of the shipborne computer to withstand harsh environments plays a very important role in ensuring the stability of the warship’s system. This paper discusses design ideas of shipborne computer deeply, by using ANSYS to analysis the vibration of equipment modal, and elaborating on the electromagnetic compatibility design of the reinforcement computer. Through computer simulation and experiment, it is shown that the design of this type of shipborne reinforcement computer can guarantee its resistance to vibration shock and electromagnetic compatibility, and make sure that it has good comprehensive protection performance.


Shipborne Reinforced computer Anti-vibration Electromagnetic compatibility 


  1. 1.
    Anonymous: Rugged Computers for Harsh Conditions. Engineering and Mining Journal, No. 8, pp. 34–38 (2018)Google Scholar
  2. 2.
    Jiangfeng, H.: Structural design of a fully enclosed airborne reinforcement computer. Ind. Control Comput. 7, 21–23 (2018)Google Scholar
  3. 3.
    Li, Y.: A small cabinet structure and strengthening protection design. Modern Manuf. Eng. 7, 123–125 (2012)Google Scholar
  4. 4.
    Lei, H.: A certain type of structural design of reinforced mainframe computer chassis. J. Mech. Manag. Dev. 22(5), 7–9 (2010)Google Scholar
  5. 5.
    Haijun, Z., Jian, J.: The construction design about a military ruggedized cabinet. In: Proceedings of the Conference on Mechanical and Electrical Engineering for the Year 2005. Electronic Industry Press, Nanjing (2005)Google Scholar
  6. 6.
    Zheng, Z., Wang, Y.: Introduction of parameters in random vibration and their calculation. J. Electr. Prod. Reliab. Environ. Test. 27(6), 45–48 (2009)Google Scholar
  7. 7.
    Yingbao, D.: Design on a new type of reinforced computer cabinet. Comput. Netw. 29(10), 42–44 (2011)Google Scholar
  8. 8.
    Liu, Z., Guo, J., Yang, L.: Random vibration analysis of airborne electronic equipment structure. J. Aeronaut. Comput. Tech. 41(4), 91–93 (2011)Google Scholar
  9. 9.
    Yong, Z., Ma, L., Liu, S., et al.: The coupling effects of thermal cycling and high current density on Sn58Bi solder joints. J. Mater. Sci. 48(6), 2318–2325 (2013)CrossRefGoogle Scholar
  10. 10.
    Hongmin, L., Zhiyong, Y., Wanyu, L.: Engineering Electromagnetic Compatibility. Xi’an University of Electronic Science and Technology Press, Xi’an (2012)Google Scholar
  11. 11.
    Putin, E., Asadulaev, A., Ivanenkov, Y.: Reinforced adversarial neural computer for de novo molecular design. J. Chem. Inf. Modeling 58(6), 1194–1204 (2018)CrossRefGoogle Scholar
  12. 12.
    Hou, H., Wang, J., Yi, X., et al.: Computer electromagnetic radiation carcinogenic doses based on Monte Carlo algorithm. Cluster Comput. 9, 1–8 (2018)Google Scholar
  13. 13.
    Wang, Q., Chen, M.: Emulation and analysis of random vibration. Electro-optic Technol. Appl. 24(5), 77–80 (2009)Google Scholar
  14. 14.
    Jinghui, C.: Construct collectivity design of ship borne electronic equipment. J. Ship Electr. Eng. 26(2), 163–166 (2006)Google Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.Jiangsu Automation Research InstituteLianyungangChina

Personalised recommendations