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Heterogeneous Integrations on Organic Substrates

  • John H. LauEmail author
Chapter

Abstract

As of today and in general for high-volume manufacturing (HVM), 70% of the RDLs (redistribution-layers) for heterogeneous integrations are on organic substrates and the metal line width and spacing are ≥10 μm. Most of these heterogeneous integrations are actually SiPs (system-in-package). No more than 5% of the RDLs for heterogeneous integrations are on organic substrates, and the metal line width and spacing are <10 μm.

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Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.ASM Pacific TechnologyHong KongHong Kong

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