Fundamentals of Nanometric Cutting of Nanotwinned Copper

  • Junjie Zhang
  • Yongda Yan
  • Tao Sun
Part of the Springer Tracts in Mechanical Engineering book series (STME)


Nanotwinned (NT) Cu containing a high density of growth twin boundaries (TBs) is one emerging precious metal for its extraordinary properties of high strength, intermediate ductility, and high electric conductivity. In the present work, we elucidate the deformation mechanisms of nanotwinned Cu subjected to the diamond cutting-based nanometric cutting by means of molecular dynamics simulations, with an emphasis on examining the influence of intrinsic microstructural parameters and extrinsic machining parameter on the nanometric cutting processes. The underlying deformation mechanisms of the materials are further correlated with the evolution of machining forces and the formation of machined surface and chips. Our simulation results indicate that dislocation slip, dislocation–TBs interactions, and TBs-associated mechanisms work in parallel in the plastic deformation of the NT Cu. In particular, dislocation–TB interactions and TBs-associated mechanisms are strongly dependent on rake angle of cutting tool, TB inclination angle, TB spacing, and grain size, which leads to strong anisotropic cutting response of NT Cu that originates from the heterogeneous localized deformation.


Nanometric cutting Nanotwinned cu Dislocation–TB interactions Material removal Molecular dynamics 



The authors greatly acknowledge financial support from the Science Challenge Project (No. TZ2018006-0201-02), the Fundamental Research Funds for the Central Universities, the National Natural Science Foundation of China (51405106) and the State Key Laboratory of Precision Measuring Technology and Instruments (Tianjin University) (PIL1405).


  1. 1.
    Lu L, Shen Y, Chen X, Qian L, Lu K (2004) Ultrahigh strength and high electrical conductivity in copper. Science 304:422–426CrossRefGoogle Scholar
  2. 2.
    Li XY, Wei YJ, Lu K, Gao HJ (2010) Dislocation nucleation governed softening and maximum strength in nano-twinned metals. Nature 464:877–880CrossRefGoogle Scholar
  3. 3.
    Yan YD, Hu ZJ, Zhao XS, Sun T, Dong S, Li XD (2010) Top-down nanomechanical machining of three-dimensional nanostructures by atomic force microscopy. Small 6:724–728CrossRefGoogle Scholar
  4. 4.
    Sun J, Luo X, Chang W, Ritchie JM, Chien J, Lee A (2012) Fabrication of periodic nanostructures by single-point diamond turning with focused ion beam built tool chips. J Micromech Microeng 22:115014CrossRefGoogle Scholar
  5. 5.
    Wu ZX, Zhang YW, Srolovitz DJ (2009) Dislocation–twin interaction mechanisms for ultrahigh strength and ductility in nanotwinned metals. Acta Mater 57:4508CrossRefGoogle Scholar
  6. 6.
    Cao AJ, Wei YG (2007) Molecular dynamics simulation of plastic deformation of nanotwinned copper. J Appl Phys 102:083511CrossRefGoogle Scholar
  7. 7.
    Tsuru T, Kaji Y, Matsunaka D, Shibutani Y (2010) Incipient plasticity of twin and stable/unstable grain boundaries during nanoindentation in copper. Phys Rev B 82:024101CrossRefGoogle Scholar
  8. 8.
    Anderoglu O, Misra A, Wang J, Hoagland RG, Hirth JP, Zhang X (2010) Plastic flow stability of nanotwinned Cu foils. Int J Plast 26:875CrossRefGoogle Scholar
  9. 9.
    Kulkarni Y, Asaro RJ (2009) Are some nanotwinned fcc metals optimal for strength, ductility and grain stability? Acta Mater 57:4835CrossRefGoogle Scholar
  10. 10.
    Qu SX, Zhou HF (2010) Hardening by twin boundary during nanoindentation in nanocrystals. Nanotechnology 21:335704CrossRefGoogle Scholar
  11. 11.
    Wang B, Zhang ZY, Cui JF, Jiang N, Lyu JL, Chen GX, Wang J, Liu ZD, Yu JH, Lin CT, Ye F, Guo DM (2017) In situ TEM study of interaction between dislocations and a single nanotwin under nanoindentation. ACS Appl Mater Interfaces 9(35):29451–29456. Scholar
  12. 12.
    Stukowski A, Albe K, Farkas D (2010) Nanotwinned fcc metals: strengthening versus softening mechanisms. Phys Rev B 82:224103CrossRefGoogle Scholar
  13. 13.
    Brown JA, Ghoniem NM (2010) Reversible–irreversible plasticity transition in twinned copper nanopillars. Acta Mater 58:886–894CrossRefGoogle Scholar
  14. 14.
    Wei YJ (2011) Anisotropic size effect in strength in coherent nanowires with tilted twins. Phys Rev B 84:014107CrossRefGoogle Scholar
  15. 15.
    Jang DC, Li XY, Gao HJ, Greer JR (2012) Deformation mechanisms in nanotwinned metal nanopillars. Nat Nanotechnol 7:594–601CrossRefGoogle Scholar
  16. 16.
    Zhang JJ, Hartmaier A, Wei YJ, Yan YD, Sun T (2013) Mechanisms of anisotropic friction in nanotwinned Cu revealed by atomistic simulations. Modell Simul Mater Sci Eng 21:065001CrossRefGoogle Scholar
  17. 17.
    Lu L, Chen X, Huang X, Lu K (2009) Revealing the maximum strength in nanotwinned copper. Science 323:607–610CrossRefGoogle Scholar
  18. 18.
    Honeycutt JD, Andersen HC (1987) Molecular dynamics study of melting and freezing of small Lennard-Jones clusters. J Phys Chem 91:4950–4963CrossRefGoogle Scholar
  19. 19.
    Zhang JJ, Wei YJ, Sun T, Hartmaier A, Yan YD, Li XD (2012) Twin boundary spacing-dependent friction in nanotwinned copper. Phys Rev B 85:054109CrossRefGoogle Scholar
  20. 20.
    Mishin Y, Mehl MJ, Papaconstantopoulos DA, Voter AF, Kress JD (2001) Phys Rev B 63:224106CrossRefGoogle Scholar
  21. 21.
    Yan YD, Sun T, Dong S, Luo XC, Liang YC (2006) Molecular dynamics simulation of processing using AFM pin tool. Appl Surf Sci 252:7523–7531CrossRefGoogle Scholar
  22. 22.
    Plimpton S (1995) Fast parallel algorithms for short-range molecular dynamics. J Comput Phys 117:1–19CrossRefGoogle Scholar
  23. 23.
    Stukowski A (2010) Visualization and analysis of atomistic simulation data with OVITO–the open visualization tool. Modell Simul Mater Sci Eng 18:015012CrossRefGoogle Scholar
  24. 24.
    Zhang JJ, Geng L, Yan YD, Sun T (2015) Effect of tool geometry in nanometric cutting of nanotwinned Cu: a molecular dynamics study. Int J Nanomanuf 11:138–149CrossRefGoogle Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.Center for Precision Engineering, Harbin Institute of TechnologyHarbinChina

Personalised recommendations