Micro-electrochemical Discharge Machining
Micro-Electrochemical Discharge Machining (μ-ECDM) is non-contact type hybrid/combined machining process which comprises two dissimilar energies as thermal and electrochemical. In simple, it is developed by comprising of two non-contact based Unconventional Machining Processes (UMPs) as Electro-Discharge Machining (EDM) and Electrochemical Machining (ECM) positively. It is broadly accepted process that applied in different areas of micro-machining and micro-fabrication related to ceramics especially glass, quartz, and Pyrex. However, it shows potential in shaping of difficult-to-shape electrically conductive materials (heat-treated alloys, titanium alloys, superalloys, Inconel, and composites) also. It is utilized for manufacturing of micro-profiles like through/blind μ-holes, μ-chutes, μ-channels, μ-slots, μ-grooves, and complex 3D μ-profiles. The basic functions of the μ-ECDM process are as to eradicate the drawback of EDM and ECM to need of electrical conductivity for machining and also to create micro-/nano-profiles on surface of ceramics. Here, the material can be removed by chemical etching, melting, and vaporization. The present chapter covers various factors related to the μ-ECDM as machining mechanism, machining system, configurations, parameters (control and performance), and process capabilities that make easier to understand the basic concept of μ-ECDM process.
KeywordsECM EDM ECSM Hybrid Machining Plasma Glass
The authors gratefully acknowledge the Elsevier and Springer Nature for their kind permission regarding reprint/reuse of figures from the published papers and also for the Copyright Clearance Centre for their support during getting the reprint/reuse permission from different resources and locations.
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