Light-emitting diodes (LEDs) are steadily growing lighting technology due to its reduced energy consumption, high light output and better lifetime as compared to incandescent lighting. However, the heat generated at LED chip during its operation, poses a considerable hurdle in its growth. In LEDs, about 70–85% of total energy is converted as heat, and only remaining 15–30% is harnessed as light energy. Excessive rise in the junction temperature (>95 °C) can cause failure of LEDs. The goal of this study is to experimentally investigate the heat transfer performance of the heat sinks using 16 W LED. The variation of case and junction temperature in LED for different configured heat sinks such as bare and finned heat sink was studied. It was observed that the case temperature (Tc) and junction temperature (Tj) reduced by 37.6 and 28.3%, respectively, for the finned heat sink as compared to the bare heat sink.
Light-emitting diode (LED) Heat sink Thermal resistance Junction temperature
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