Copper Grain Boundary Diffusion and Diffusion Induced Creep in Nanostructured Nickel
Nanostructured (NS) materials (grain size d ≤ 100 nm) are currently being intensively investigated. This special attention is due to the distinct physical, mechanical and other properties compared to when they are coarse-grained (CG) . In particular, it has been found that diffusion coefficients (D) in NS materials exceed by several orders of magnitude the respective values in CG materials [2–4]. However, the physical reasons for the anomalously high values of D in these materials are debatable. The authors of  suggest that the self-diffusion in nanostructured Ni prepared by the inert gas condensation method occurs mainly along the boundaries of clusters and on the surface of pores located there. Clusters (having size 1–10 µm) consist of the complexes of nanoparticles having grain size d ≤ 100 nm. Diffusion along nanoparticles boundaries inside a cluster does not differ from grain boundary diffusion in CG materials, while diffusion along cluster boundaries closely resembles surface diffusion.
KeywordsBoundary Diffusion Diffusion Annealing Copper Diffusivity Polycrystal Plasticity Nanostructured Nickel
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