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Copper Grain Boundary Diffusion and Diffusion Induced Creep in Nanostructured Nickel

  • Yu. R. Kolobov
  • G. P. Grabovetskaya
  • M. B. Ivanov
  • R. Z. Valiev
  • T. C. Lowe
Part of the NATO Science Series book series (ASHT, volume 80)

Abstract

Nanostructured (NS) materials (grain size d ≤ 100 nm) are currently being intensively investigated. This special attention is due to the distinct physical, mechanical and other properties compared to when they are coarse-grained (CG) [1]. In particular, it has been found that diffusion coefficients (D) in NS materials exceed by several orders of magnitude the respective values in CG materials [2–4]. However, the physical reasons for the anomalously high values of D in these materials are debatable. The authors of [4] suggest that the self-diffusion in nanostructured Ni prepared by the inert gas condensation method occurs mainly along the boundaries of clusters and on the surface of pores located there. Clusters (having size 1–10 µm) consist of the complexes of nanoparticles having grain size d ≤ 100 nm. Diffusion along nanoparticles boundaries inside a cluster does not differ from grain boundary diffusion in CG materials, while diffusion along cluster boundaries closely resembles surface diffusion.

Keywords

Boundary Diffusion Diffusion Annealing Copper Diffusivity Polycrystal Plasticity Nanostructured Nickel 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media Dordrecht 2000

Authors and Affiliations

  • Yu. R. Kolobov
    • 1
  • G. P. Grabovetskaya
    • 1
  • M. B. Ivanov
    • 1
  • R. Z. Valiev
    • 2
  • T. C. Lowe
    • 3
  1. 1.Institute of Strength Physics and Material ScienceRussian Academy of ScienceTomskRussia
  2. 2.Institute of Physics of Advanced MaterialsRussian Academy of ScienceUfaRussia
  3. 3.Los Alamos National LaboratoryUSA

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