Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures pp 489-494 | Cite as
Indentation of Semiconductor Superlattices
Chapter
Abstract
A study is presented of low load indentations made into GaAs/AlAs superlattices and Si/SixGe1−x strained layer superlattices. We have studied the indentation sites using high resolution scanning electron microscopy (SEM) which allows us to distinguish between the individual layers due to the differences in the secondary electron (SE) yields of the materials. Transverse cleavage through the indentation sites reveals the pattern of the deformed multilayers, showing in particular a region of compressive strains of up to 30%.
Keywords
Secondary Electron Secondary Electron Image High Resolution Scanning Electron Microscopy Indentation Site Semiconductor SUPERLATTICES
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References
- [1].Ogura, K. (1991) ‘Observation of GaAs/AlxGal-xAs superlattice by backscattered electron image obtained with an ultrahigh-resolution SEM’, JEOL news 29E, 26–31.Google Scholar
- [2].Page T.F., Oliver W.C. and McHargue, C.J. (1992) ‘The deformation behavior of ceramic crystals subjected to very low load (nano)indentations’, J. Mater. Res. 7, 450–473.CrossRefGoogle Scholar
- [3].Castell M.R., Walls M.G. and Howie, A. (1992) ‘Imaging of low load indentations into Si and GaAs by STM’, Ultramicroscopy, in press.Google Scholar
- [4].Johnson, K.L. (1985) Contact Mechanics, Cambridge University Press, pp. 172–177.Google Scholar
- [5].Pharr G.M., Oliver W.C. and Clarke, D.R. (1990) ‘The mechanical behavior of Silicon during small-scale indentation’, J. of Electronic Mat. 19, 881–887.CrossRefGoogle Scholar
- [6].Clarke D.R., Kroll M.C., Kirchner P.D., Cook R.F and Hockey, B.J. (1988) ‘Amorphization and conductivity of Silicon and Germanium induced by indentation’, Phys. Rev. Lett. 60, 2156–2159.CrossRefGoogle Scholar
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© Springer Science+Business Media Dordrecht 1993