Cure Characteristic Determination Using Microelectronic Dielectric Sensors

  • D. Day
  • H. Lee
  • K. Russell
  • J. Whiteside

Abstract

The development of microdielectrometry has made possible production monitoring and cure control in a variety of thermoset resin based systems. As the demands of the technology grow, existing sensors must be demonstrated to have applicability or new sensors must be designed.

Keywords

Loss Factor Polyurethane Foam Dielectric Loss Factor Dipole Motion Thermal Diode 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    S.D. Senturia, N.F. Sheppard, H.L. Lee, and D.R. Day, “In Situ Measurement of the Properties of Curing Systems with Microdielectrometry,” Jrnl. Adhesion, 15, 69 (1982)CrossRefGoogle Scholar
  2. 2.
    N.F. Sheppard, M. Coln, and S. Senturia, “A Dielectric Study of The Time Temperature Transformatton (TTT) Diagram of DEGBA Epoxy Resins Cured with DDS,” Proc. 29th SAMPE Symposium, Reno, NV, 1243 (1984)Google Scholar
  3. 3.
    A.R. Blythe, “Electrical Properties of Polymers,” Cambridge University Press, Cambridge.Google Scholar
  4. 4.
    D.R. Day, T.J. Lewis, H.L. Lee, and S.D. Senturia, “The Role of Boundary Layer Capacitance at Blocking Electrodes in the Interpretation of Dielectric Cure Data in Adhesives,” Jrnl. Adhesion, 18, 73 (1984)CrossRefGoogle Scholar
  5. 5.
    “Computer Aided Curing of Composites,” 5th Quarterly Interim Technical Report, Contract F33615-83-C-5088, McDonnell Aircraft Company, St. Louis, MO, July 1985Google Scholar
  6. 6.
    M.L. Bromberg, D.R. Day, and K.R. Snable, “Measurement and Application of Dielectric Properties,” Electrical Insulation, 2,18 (1986)CrossRefGoogle Scholar
  7. 7.
    D.R. Day, “Effects of Stoichiometric Mixing Ratio on Epoxy Cure: A Dielectric Analysis,” SPE Technical Papers, 31, 327 (1985)Google Scholar

Copyright information

© Springer Science+Business Media B.V. 1989

Authors and Affiliations

  • D. Day
    • 1
  • H. Lee
    • 1
  • K. Russell
    • 1
  • J. Whiteside
    • 1
  1. 1.Micromet Instruments Inc.CambridgeUSA

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