High Tc Superconducting Interconnections in Semiconductor - Based Electronic Systems

  • Robert C. Frye
Part of the NATO ASI Series book series (NSSE, volume 160)

Abstract

Recent materials advances have demonstrated superconductivity at temperatures well above 77K. It is no longer unreasonable to consider electronic systems based on superconducting interconnections and semiconductor devices. The interconnections between devices occur on several levels, ranging from the large scale, printed-wiring-board sized structures, down to the very small lines that connect devices on a single chip. An important question to begin to examine at this stage is where, within the hierarchy of device interconnections, it is most (or least) advantageous to consider using superconductors. This paper will present analytical results that address two important issues: the performance benefits of a resistance-free interconnection technology and the levels of critical current density that the superconductors must exhibit in order to realize these benefits.

Keywords

Critical Current Density Ground Plane Characteristic Impedance Thin Film Hybrid Couple Wave Equation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    T. C. Edwards “Foundations for Microstrip Circuit Design” John Wiley and Sons, New York (1981).Google Scholar
  2. 2.
    W. D. McCaa and N. S. Nahman, J. Appi. Phys. 39 2592 (1968).ADSCrossRefGoogle Scholar
  3. 3.
    W. D. McCaa and N. S. Nahman, J. Appi. Phys. 40 2098 (1969).ADSCrossRefGoogle Scholar
  4. 4.
    A. J. Rainal, AT and T Bell Laboratories Tech. J. 63 177 (1984).Google Scholar
  5. 5.
    C. J. Stranghan and B. M. MacDonald, IEEE Proc. 35th Electronic Components Conf. 361 (1985).Google Scholar
  6. 6.
    E. T. Lewis, IEEE Trans. Components, Hybrids and Manuf. Tech. CHMT-2 441 (1979).Google Scholar
  7. 7.
    C. W. Ho, D. A. Chance, C. H. Bajorek and R. E. Acosta, IBM J. Res. Dev. 26 268 (1982).CrossRefGoogle Scholar
  8. 8.
    C. J. Bartlett, J. M. Segelken and N. A. Teneketges, IEEE Trans. Components, Hybrids and Manuf. Tech. CHMT-10 647 (1987).Google Scholar
  9. 9.
    D. Herell and D. Carey, IEEE Trans. Components, Hybrids and Manuf. Tech. CHMT-10 99 (1987).Google Scholar

Copyright information

© Kluwer Academic Publishers 1989

Authors and Affiliations

  • Robert C. Frye

There are no affiliations available

Personalised recommendations