Advertisement

Challenges of the Miniaturization in the Electronics Production on the example of 01005 Components

  • Jens NiemannEmail author
  • Stefan Härter
  • Christopher Kästle
  • Jörg Franke
Conference paper

Abstract

The electronics production experiences a continuous trend towards miniaturization of components. Smaller components lead to a number of challenges in the Surface Mount Technology (SMT) process chain to ensure a stable production process. This paper provides an overview on the main SMT production processes and focuses on the stencil printing process, which is said to be an error-prone process and has the demand of further optimization and research. One important criteria for the solder paste printing stencils is the area ratio (AR), which is defined by the IPC-7525 as the area of the aperture opening to the area of the aperture walls. Especially in mixed assembly designs AR is becoming critical low for the miniaturized 01005 components. In this paper, the printing process for miniaturized components is investigated using specially designed area ratio test stencils and an active squeegee system. The design of these stencils includes values for the AR from 0.65 down to 0.45 with different aperture shapes, which include gradually adjusted in length and width, rectangles as well as circular apertures for reference. Furthermore, the orientation of the rectangular apertures in relation to the printing direction is regarded. To include the effect of the active squeegee system all tests were conducted with the system activated as well as deactivated.

Keywords

SMT Production Miniaturization 01005 components stencil printing 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. [1] K. VIJAY: Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window, 18th European Microelectronics and Packaging, Brighton. In: IMAPS-Europe, S. 26–29Google Scholar
  2. [2] C. COMBET, M.-M. CHANG: 01005 Assembly, the AOI route to optimizing yield. In: Vi TECHNOLOGY Jul. 2009Google Scholar
  3. [3] R. S. CLOUTHIER: The complete solder paste printing processes. In: SMT Magazine vol. 13 (1999), S. 6–8Google Scholar
  4. [4] C. H. MANGIN: Where quality is lost on SMT boards. In: Circuit Assembly no. 2 (1991), S. 63–64Google Scholar
  5. [5] M. WHITMORE, J. D. SCHAKE, C. ASHMORE: The impact of stencil aperture design for next generation ultra-fine pitch printing. In: Proceedings of the 35th International Electronics Manufacturing Technology Conference (2012), S. 1–7Google Scholar
  6. [6] S. HÄRTER; J. NIEMANN, J. FRANKE, M. WHITMORE, J. D. SCHAKE: The Effect of area shape and area ratio on solder paste printing performance. In: Proceedings Surface Mount Technology Association International Conference (SMTAI) Rosemont, IL (2016), S. 613–620Google Scholar
  7. [7] M. RÖSCH: Potenziale und Strategien zur Optimierungdes Schablonendruckprozesses in der Elektronikproduktion. Bamberg: Meisenbach, 2011 (Fertigungstechnik 221)Google Scholar
  8. [8] S. HÄRTER, C. LÄNTZSCH, J. FRANKE: Fundamental study on a secure printing process using NanoWork stencils for 01005 components. In: Proceedings Surface Mount Technology Association International Conference (SMTAI) Rosemont, IL (2014), S. 878–884Google Scholar
  9. [9] M. RÖSCH; J. FRANKE; C. LÄNTZSCH; G. KLEEMANN: Characteristics and Potentials of nana-coated stencils for stencil printing optimization. In: Universität Erlangen-Nürnberg FAPS (2010)Google Scholar
  10. [10] S. HÄRTER: Evaluation of the Stencil Printing for Highly Minia-turized SMT Components with 03015mm in Size. In: Proceedings Surface Mount Technology Association International Conference (SMTAI) Rosemont, IL (2015), S. 756–764Google Scholar
  11. [11] F. SCHÜßLER, D. KOZIC, J. FRANKE: Influences on the reflow soldering process by components with specific thermal properties. In: Circuit World Vol. 35 (2009), S. 35–42Google Scholar

Copyright information

© Springer-Verlag GmbH Deutschland 2017

Authors and Affiliations

  • Jens Niemann
    • 1
    Email author
  • Stefan Härter
    • 1
  • Christopher Kästle
    • 1
  • Jörg Franke
    • 1
  1. 1.Institute for Factory Automation and Production System (FAPS)University Erlangen-NurembergNurembergDeutschland

Personalised recommendations