Technology of Integrated Circuits pp 235-248 | Cite as
Cleaning technology
Chapter
Abstract
In the earlier chapters, frequent mention was made of the damaging effect of contaminants in the silicon substrate, in the various layers and on the surfaces of the integrated circuit. This chapter summarizes the various types of contamination, and describes the measures employed to prevent or remove contaminants.
Keywords
Silicon Wafer Wafer Surface Clean Room Depletion Zone Particulate Contamination
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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References
- 7.1Melzner, H.: Siemens AG, Private communicationsGoogle Scholar
- 7.2Steinman, A.: Semiconductor Fabtech (1995) 203Google Scholar
- 7.3Reichardt, H.: Semiconductor Fabtech (1995) 139Google Scholar
- 7.4Kern, W.; Puotinen. D.A.: RCA Review (June 1970) 187Google Scholar
- 7.5Schwartzman, S.; Mayer, A.; Kern, W.: RCA Review (March 1985)Google Scholar
- 7.6Bitto, R: Siemens AG, Private communicationsGoogle Scholar
- 7.7Ohmi, T.: Semiconductor Fabtech (1995) 79Google Scholar
- 7.8Rieger, E: Siemens AG, Private communicationsGoogle Scholar
- 7.9Schild, R.; Locke, K.; Kozak, M.; Heyns, M.M.: Proc. 2nd Int. Symp. UCPSS, Leuven (Sept. 1994) 31Google Scholar
- 7.10Gath, H.C.; Honold, A.; Simon, R.: Semiconductor Fabtech (1994) 51Google Scholar
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