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Modeling and Simulation of Electrothermomechanical Coupling Phenomena in High Power Electronics

  • P. Böhm
  • Y. C. Gerstenmaier
  • R. H. W. Hoppe
  • Y. Iliash
  • G. Mazurkevitch
  • G. Wachutka
Part of the Lecture Notes in Computational Science and Engineering book series (LNCSE, volume 21)

Abstract

High power electronic devices based on innovative semiconductor technology play a significant role in technical applications. A robust operating behavior of such devices can be achieved by an optimal design taking into account the presence of coupled physical effects

In this contribution, we focus on electrothermomechanical coupling phenomena in Integrated-High-Voltage Modules with housing and cooling mechanisms that are used as electric drives for high power electromotors. For the numerical solution of the underlying coupled systems of partial differential equations we consider efficient algorithmic tools such as domain decomposition techniques

Keywords

Solder Joint Domain Decomposition Posteriori Error Finite Element Space Power Diode 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2002

Authors and Affiliations

  • P. Böhm
    • 1
  • Y. C. Gerstenmaier
    • 1
  • R. H. W. Hoppe
    • 2
  • Y. Iliash
    • 2
  • G. Mazurkevitch
    • 2
  • G. Wachutka
    • 1
  1. 1.Munich University of TechnologyPhysics of ElectrotechnologyMunichGermany
  2. 2.University of AugsburgInstitute of MathematicsAugsburgGermany

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