Intelligent Autonomous Systems 12 pp 707-716 | Cite as
Real-Time 3D Model Reconstruction with a Dual-Laser Triangulation System for Assembly Line Completeness Inspection
Conference paper
Abstract
In this paper, we present an improved version of our Dual Laser Triangulation System, a low-cost color 3D model acquisition system built with commonly available machine vision products. The system produces a color point cloud model of scanned objects that can be used to perform completeness inspection tasks on assembly lines. In particular, we show that model acquisition and reconstruction can be achieved in real-time using such a low-cost solution. Our results demonstrate that 3D-based inspection can be achieved readily and economically in a real industrial production environment.
Preview
Unable to display preview. Download preview PDF.
References
- 1.Bernardini, F., Rushmeier, H.: The 3D model acquisition pipeline. Computer Graphics Forum 21(2), 149–172 (2002)CrossRefGoogle Scholar
- 2.Bi, Z., Wang, L.: Advances in 3D data acquisition and processing for industrial applications. Robotics and Computer-Integrated Manufacturing 26(5), 403–413 (2010)CrossRefGoogle Scholar
- 3.Haralick, R., Joo, H., Lee, C., Zhuang, X., Vaidya, V., Kim, M.: Pose estimation from corresponding point data. IEEE Transactions on Systems, Man and Cybernetics 19(6), 1426–1446 (1989)CrossRefGoogle Scholar
- 4.Malamas, E.N., Petrakis, E.G.M., Zervakis, M., Petit, L., Legat, J.: A survey on industrial vision systems, applications and tools. Image and Vision Computing 21(2), 171–188 (2003)CrossRefGoogle Scholar
- 5.Munaro, M., Michieletto, S., So, E., Alberton, D., Menegatti, E.: Fast 2.5D model reconstruction of assembled parts with high occlusion for completeness inspection. In: International Conference on Machine Vision, Image Processing, and Pattern Analysis (2011)Google Scholar
- 6.Zhang, Z.: A flexible new technique for camera calibration. IEEE Transactions on Pattern Analysis and Machine Intelligence 22(11), 1330–1334 (2000)CrossRefGoogle Scholar
Copyright information
© Springer-Verlag Berlin Heidelberg 2013