Numerical Investigation of Nano-Material Processing by Thermal Plasma Flows

Conference paper

Abstract

The high performance of supercomputing systems has made it feasible to clarify multi-scale physics of nano-material processes in thermal plasma environments with thermofluidic and electromagnetic interactions.In this chapter, two challenges related to the thermal plasma processing of nanoparticle fabrication are presented as new applications of supercomputing. The growth process of titanium boride nanoparticles from the precursory binary vapors of titanium and boron is computed using a unique mathematical model. In consequence, the collective and simultaneous growth behavior through nucleation, co-condensation and coagulation is clarified. The 3-D complex structure of the thermofluid field in/around an argon inductively coupled thermal plasma (ICTP) has also been revealed. The higher-temperature region has larger vortices, whereas the lower-temperature flow forms smaller eddies. Because a high-temperature plasma has a high electrical conductivity, the Lorentz forces are generated there; and consequently recirculating zones are produced. In addition, it is also clarified that turbulent and laminar regions co-exist and form a complicated flow field in the ICTP torch.

Notes

Acknowledgements

This work was partly supported by the Japan Society for the Promotion of Science Grant-in-Aid for Scientific Research (C) (Grant No. 23560182); the results of this study were obtained using the supercomputing resources of Cyberscience Center, Tohoku University. The author expresses his gratitude to Dr. Yu Fukunishi and Dr. Seiichiro Izawa of Tohoku University for valuable advices about the vortex identification and to Dr. Takayuki Watanabe of Tokyo Institute of Technology for the experimental insight of titanium boride nanoparticle synthesis. In addition, the author would like to thank Mr. Takashi Soga of NEC System Technology, Ltd. and Mr. Takeshi Yamashita of Tohoku University for improving the solver code.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2013

Authors and Affiliations

  1. 1.Tohoku UniversitySendaiJapan

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