Scaling Effects for Miniaturized Solder Interconnects in Electronic Packages

Chapter

Abstract

This chapter gives an overview about solder interconnects in electronic packages and their important influence on reliability. The future demands for higher pin counts in electronic components caused by the fast pace of miniaturisation in the semiconductor process, pose new challenges for solder interconnects. It will be shown that miniaturization of solder volume has a strong influence on microstructure. Changes of the mechanical behaviour will be presented and the influence on reliability will be discussed.

Keywords

Solder Joint Print Circuit Board Solder Ball Solder Bump Solder Material 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2012

Authors and Affiliations

  1. 1.Institute of Electronic Packaging TechnologyTechnische Universität DresdenDresdenGermany

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