Quality and Reliability Assurance During the Production Phase (Basic Considerations)

Keywords

Solder Joint Thermal Cycle Electronic Component Production Phase Screening Strategy 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

8 Quality and Reliability Assurance During the Production Phase

Production Processes

  1. [8.1]
    Desplas E.P., “Rel. in the manufacturing cycle”, Proc. Ann. Rel. & Maint. Symp., 1986, pp. 139–44.Google Scholar
  2. [8.2]
    DGQ 16-31/-32/-33: SPC 1/2/3 Statistische Prozesslenkung, 1990.Google Scholar
  3. [8.3]
    Ellis B.N., Cleaning and Contamination of Electronics Components and Assemblies, 1986, Electrochemical Publ., Ayr (Scotland).Google Scholar
  4. [8.4]
    Hnatek E. R., Integrated Circuit Quality and Reliability, 2nd Ed. 1999, Dekker, NY.Google Scholar
  5. [8.5]
    Grossmann G., “Contamination of various flux-cleaning combinations on SMT assemblies, Soldering & SMT, 22 (1996) Feb., pp. 16–21CrossRefGoogle Scholar
  6. [8.6]
    Lea C, A Scientific Guide to SMT, 1988, Electrochemical Publ., Ayr (Scotland).Google Scholar
  7. [8.7]
    Lenz E., Automatisiertes Löten elektronischer Baugruppen, 1985, Siemens, Munich.Google Scholar
  8. [8.8]
    Pawling J.F. (Ed.), Surface Mounted Assemblies, 1987, Electrochemical Publ., Ayr (Scotland).Google Scholar
  9. [8.9]
    Pecht M. et al., Contamination of Electronic Assemblies, 2002, CRC Press, NY.Google Scholar
  10. [8.10]
    Prasad R.P., Surface Mount Technology, 1989, Van Nostrand Reinhold, NY.Google Scholar
  11. [8.11]
    Shewhart W.A., “Quality control charts”, Bell Tech. Jurn., 5(1926) pp. 593–603.Google Scholar
  12. [8.12]
    Scraft R., Bleicher M. (Eds.), Oberflächenmontage elektronischer Bauelemente, 1987, Hütig, Heidelberg.Google Scholar
  13. [8.13]
    Stein R.E., Re-Engineering the Manufacturing System, 4th Printing 1996, Dekker, NY.Google Scholar
  14. [8.14]
    Vardaman J. (Ed.), Surface Mount Technology: Recent Jap. Dev, 1993, IEEE Press, Piscataway NJ.Google Scholar
  15. [8.15]
    Wassink R.J.K., Soldering in Electronic, 2nd Ed. 1989, Electrochemical Publ., Ayr (Scotland).Google Scholar

Test and Screening Strategies

  1. [8.21]
    Bennetts R.G., Introduction to Digital Board Testing, 1981, Crane Russak, NY.Google Scholar
  2. [8.22]
    Birolini A., “Möglichkeiten und Grenzen der Qualifikation, Prüfung und Vorbeh. von ICs”, QZ, 27 (1982) 11, pp. 321–326; “Prüfung und Vorbeh. von Bauelementen und Leiterplatten”, VDI-Bericht Nr. 519, pp. 49–61 1984; “VLSI testing and screening”, Journal of Env. Sciences (IES), May/June 1989, pp. 42–48; “Matériels électroniques: strategies de test et de déverminage”, La Revue des Lab. d’Essais, 1989 pp. 18–21; — and Grossmann G., “Experimentelle Ergebnisse zur Qualität und Zuverlässigkeit der SMT mit Pitch 0.5 mm”, me (1995) 5, pp. 28–33.Google Scholar
  3. [8.23]
    Bullock M., Designing SMT boards for in-circuit testability”, Proc. Int. Test Conf., 1987, pp.606–13.Google Scholar
  4. [8.24]
    De Cristoforo R.J., “Environmental stress screening-lesson learned”, Proc. Ann. Rel. & Maint. Symp., 1984, pp. 129–133.Google Scholar
  5. [8.25]
    Desplas E., “Reliability in the manuf. cycle”, Proc. Ann. Rel. & Maint. Symp., 1986, pp. 139–144.Google Scholar
  6. [8.26]
    Geniaux B. et al, Déverminage des matériels électroniques, 1986, ASTE, Paris; “Climatique et déverminage”, La Revue des Lab. d’Essais, Sept. 1989, pp. 5–8.Google Scholar
  7. [8.27]
    IEC 61163: Rel. Stress Screening-Part 1: Repair. Items, 2006;-Part 2: Electronic Comp., 1998.Google Scholar
  8. [8.28]
    IES, Environmental Stress Screening Guideline for Assemblies, 1988; Guidelines for Parts, 1985; Environmental Test Tailoring, 1986; Environmental Stress Screening, 1989.Google Scholar
  9. [8.29]
    Kallis J.M., Hammond W.K., Curry B., “Stress screening of electronic modules: Investigation of effects of temp. rate-of-change”, Proc. Ann. Rel. & Maint. Symp., 1990, pp. 59–66.Google Scholar
  10. [8.30]
    Kim K. et al., “Some considerations on system burn-in”, IEEE Trans. Rel., 54(2005)2, pp. 207–214.CrossRefGoogle Scholar
  11. [8.31]
    Kindig W., McGrath J., “Vibration, random required”, Proc. Ann. Rel. & Maint. Symp., 1984, pp. 143–147.Google Scholar
  12. [8.32]
    MIL-HDBK-344: Environmental Stress Screening of Electronic Equipment, 1986; see also-HDBK-263,-STD-810,-STD-883, and-STD-2164.Google Scholar
  13. [8.33]
    Parker P., Webb C., “A study of failures identified during board level environmental stress testing”, IEEE Tran. Comp. Pack., and Manuf. Technol., 15(1992)6, pp. 1086–1092.CrossRefGoogle Scholar
  14. [8.34]
    Pynn C., Strategies for Electronics Test, 1986, McGraw-Hill, NY.Google Scholar
  15. [8.35]
    Wennberg S.R., Freyler C.R., “Cost-effective vibration testing for automotive electronic”, Proc. Ann. Rel. & Maint. Symp., 1990, pp. 157–159.Google Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2007

Personalised recommendations