Modeling and Simulation for Thermal-Electric Coupling in an SOI-Circuit

A. Bartel; U. Feldmann

doi:10.1007/978-3-540-32862-9_4

Scientific Computing in Electrical Engineering pp 27-32 | Cite as

Modeling and Simulation for Thermal-Electric Coupling in an SOI-Circuit

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A. Bartel
U. Feldmann

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Part of the Mathematics in Industry book series (MATHINDUSTRY, volume 9)

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Ring Oscillator Circuit Simulation Communication Step Benchmark Circuit Thermal Network

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Authors and Affiliations

A. Bartel
- 1
U. Feldmann
- 2

1.Lehrstuhl für Angewandte Mathematik/Numerische AnalysisUniversität WuppertalWuppertalGermany
2.Infineon Technologies AGMünchenGermany

About this paper

Cite this paper as:: Bartel A., Feldmann U. (2006) Modeling and Simulation for Thermal-Electric Coupling in an SOI-Circuit. In: Anile A.M., Alì G., Mascali G. (eds) Scientific Computing in Electrical Engineering. Mathematics in Industry, vol 9. Springer, Berlin, Heidelberg

DOI https://doi.org/10.1007/978-3-540-32862-9_4
Publisher Name Springer, Berlin, Heidelberg
Print ISBN 978-3-540-32861-2
Online ISBN 978-3-540-32862-9
eBook Packages Mathematics and Statistics

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