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Wafer Die Position Detection Using Hierarchical Gray Level Corner Detector

  • Jae Hyung Na
  • Hae Seok Oh
Conference paper
Part of the Lecture Notes in Computer Science book series (LNCS, volume 3070)

Abstract

In this paper, we will introduce a method for wafer die position detection using corner detector. We present a hierarchical gray level corner detector (HGLCD) to detect die position accurately. HGLCD divides the corner region into many homocentric circles and get corner response and angle about each circle. The experiments have shown that the new corner detector is more accurate and more efficient in its performance than other two popular corner detectors.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2004

Authors and Affiliations

  • Jae Hyung Na
    • 1
  • Hae Seok Oh
    • 1
  1. 1.Soongsil UniversitySeoulKorea

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