Wafer Die Position Detection Using Hierarchical Gray Level Corner Detector
In this paper, we will introduce a method for wafer die position detection using corner detector. We present a hierarchical gray level corner detector (HGLCD) to detect die position accurately. HGLCD divides the corner region into many homocentric circles and get corner response and angle about each circle. The experiments have shown that the new corner detector is more accurate and more efficient in its performance than other two popular corner detectors.
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