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Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint

  • Y. H. MeiEmail author
  • Z. Wang
  • K. S. Siow
Chapter
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Abstract

This chapter reviews the reliability of sintered Ag joint in terms of elastic modulus, shear strength, tensile strength, creep strength, fatigue strength, and related failure mechanisms under normal and accelerated conditions, as well as failure mechanism like electrochemical migration. While it is technically feasible to produce sintered Ag joint to meet the package design requirement, its long-term reliability is a subject of continuous research and development. Sufficient densification and microstructure stability (grain boundary and interfacial metallization quality) of the sintered Ag joints form the critical strategies in producing a reliable joint. With a better understanding of the failure mechanisms and contributing factors described in this chapter, modifications in Ag paste formulation, sintering conditions, interfacial metallization, and innovative package designs will be able to alleviate these issues to improve the community’s confidence in this bonding technique.

Keywords

Power cycling Thermal cycling Thermal aging Electrochemical migration (ECM) Elastic modulus Shear strength Dwell time Creep Fatigue strength Ratcheting 
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Notes

Acknowledgment

SKS acknowledges Universiti Kebangsaan Malaysia Research Grants (GUP-2017-055 “Production of Metallic Conducting Nanowires for Industrial Applications”) for this work.

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© Springer Nature Switzerland AG 2019

Authors and Affiliations

  1. 1.Tianjin Key Laboratory of Advanced Joining Technology & Center of High-Temperature Electronic Packaging, School of Materials Science and EngineeringTianjin UniversityTianjinChina
  2. 2.Key Laboratory of Advanced Ceramics and Machining TechnologyMinistry of EducationTianjinChina
  3. 3.Institute of Microengineering and NanoelectronicsUniversiti Kebangsaan MalaysiaBangiMalaysia

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