Study on the Conventional Versus Photonic (IPL) Sintering of Copper Nanoparticle (Cu NPs) Inks on Different Flexible Substrates
In General, flexible substrates can only with stand a very low temperature. High processing time on conventional sintering methods can deteriorate the substrate. Photonic sintering uses intense pulsed light with a broad spectrum in the visible range to sinter metal precursor inks in a selective manner (Perelaer and Schuber in Mater Res Soc 28:564–573, 2013 ). Intense Pulsed light sintering is the process of sintering conductive inks and thin films in milliseconds (processing time) without heating the underlying substrate. Inexpensive substrates can be thermally processed without extending the processing time. According to the end use, the conductivity values are optimized. Since this process cures thin films at high temperature on low temperature substrate it is a good option for polymers, papers and glass substrates (substrate variability). Improved conductive performance is achieved through this process.
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