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Fabrication of MEMS Capacitive Pressure Sensor (MCPS) with Segmented Bossed Diaphragm

  • Ameen MajeedEmail author
  • P. Ramesh
Conference paper
Part of the Springer Proceedings in Physics book series (SPPHY, volume 215)

Abstract

MEMS capacitive pressure sensors can be used for touch mode applications with pressure ranging from 0.05 to 2 MPa (Ramesh AK, Ramesh P in Trade-off between sensitivity and dynamic range in designing MEMS capacitive pressure sensor, in TENCON 2015–2015 IEEE Region 10 Conference (IEEE, 2015)[1]). This paper explains about the fabrication of the MEMS Capacitive Pressure Sensor (MCPS) with bossed diaphragm as well as the modification made to the boss structure (Ramesh AK, Ramesh P in A segmented boss structure for MEMS capacitive sensor diaphragm. J. Micro-fab. MEMS (2015) [2]) in order to improve the sensor characteristics. Before that the fabrication of the boss structure is explained from which the segmented boss structure is obtained.

References

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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  1. 1.Department of Electronics and Communication EngineeringCollege of Engineering MunnarMunnarIndia

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