IBII Test for High Strain Rate Tensile Testing of Adhesives
This paper presents the application of the new Image-Based Inertial Impact (IBII) test methodology to study the high strain rate response of adhesives. It relies on an inertial impact (spalling-like) test configuration and the use of ultra-high speed imaging to record the deformation of the test specimen in the MHz range. The underlying novelty is to use the acceleration obtained from the time-resolved displacement maps to derive stress information leading to the identification of the material constitutive parameters. Here, an epoxy adhesive is tested at strain rates up to 1000 s−1 and its modulus and tensile strength are successfully derived from just the deformed images.
KeywordsHigh strain rate Adhesive High speed imaging Virtual fields method Impact
The authors gratefully acknowledge funding from EPSRC, grant EP/L026910/1.
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