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Time-to-Failure Modeling

  • J. W. McPherson
Chapter

Abstract

All materials tend to degrade, and will eventually fail, with time. For example, metals tend to creep and fatigue; dielectrics tend to trap charge and breakdown; paint tends to crack and peel; polymers tend to lose their elasticity and become more brittle, teeth tend to decay and fracture; etc. All devices (electrical, mechanical, electromechanical, biomechanical, bioelectrical, etc.) will tend to degrade with time and eventually fail. The rate of degradation and eventual time-to-failure (TF) will depend on the electrical, thermal, mechanical, and chemical environments to which the device is exposed.

Bibliography

  1. McPherson, J.: Stress Dependent Activation Energy, IEEE International Reliability Physics Symposium Proceedings, 12(1986).Google Scholar
  2. McPherson, J. and E. Ogawa: Reliability physics and engineering. In: Handbook of Semiconductor Manufacturing Technology, 2nd Edition, CRC Press, (2008).Google Scholar

Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • J. W. McPherson
    • 1
  1. 1.McPherson Reliability Consulting, LLCPlanoUSA

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