Parametric Study on Thermal Performance of PCM Heat Sink Used for Electronic Cooling

  • Salma GharbiEmail author
  • Souad Harmand
  • Sadok Ben Jabrallah
Part of the Green Energy and Technology book series (GREEN)


This work presents a numerical study on the thermal behavior of a PCM heat sink for the purpose of electronic cooling. Introducing copper fins inside a PCM heat sink was examined. A parametric study was performed to maximize the critical time elapsed before reaching the allowable temperature limit for different fin lengths, numbers, and thicknesses for the same copper amount. This amount was also evaluated as a perimeter envelope of the PCM. The enthalpy method was carried out. Natural convection in melted PCM was taken into account. The governing equations were solved by Comsol Multiphysics. This model was validated by comparing results with numerical data by Huang et al. (Int J Heat Mass Transf 47:2715–2733, 2004). The results indicated that the inclusion of fins can enhance the thermal performance of heat sink by increasing the exchange surface and ensuring better heat repartition inside the PCM. The fin geometry presented an important role in thermal control improvement. Although a significant difference was showed in temperature between the copper envelope and the copper fins, they present the same efficience for low heat flux.


Phase change material Heat sink Electronic cooling 



The authors would like to acknowledge the Laboratory of TEMPO for its collaboration in this research.


  1. Akhilesh, R., Narasimhan, A., Balaji, C.: Method to improve geometry for heat transfer enhancement in PCM composite heat sinks. Int. J. Heat Mass Transf. 48, 2759–2770 (2005)CrossRefGoogle Scholar
  2. Hosseinizadeh, S.F., Tan, F.L., Moosania, S.M.: Experimental and numerical studies on performance of PCM-based heat sink with different configurations of internal fins. Appl. Therm. Eng. 31, 3827–3838 (2011)CrossRefGoogle Scholar
  3. Huang, M.J., Eames, P.C., Norton, B.: Thermal regulation of building integrated photovoltaics using phase change materials. Int. J. Heat Mass Transf. 47, 2715–2733 (2004)CrossRefGoogle Scholar
  4. Leland, J., Recktenwald, G.: Optimization of a Phase Change Heat Sink for Extreme Environments. Mech. Eng. Dept. Portland State University, Portland, Oregon (2003)Google Scholar
  5. Nayak, K.C., Saha, S.K., Srinivasan, K., Dutta, P.: A numerical model for heat sinks with phase change materials and thermal conductivity enhancers. Int. J. Heat Mass Transf. 49, 1833–1844 (2006)CrossRefGoogle Scholar
  6. Sharifi, N., Bergman, T.L., Faghri, A.: Enhancement of PCM melting in enclosures with horizontally-finned internal surfaces. Int. J. Heat Mass Transf. 54, 4182–4192 (2011)CrossRefGoogle Scholar
  7. Shatikian, V., Ziskind, G., Letan, R.: Numerical investigation of a PCM-based heat sink with internal fins. Int. J. Heat Mass Transf. 48, 3689–3706 (2005)CrossRefGoogle Scholar

Copyright information

© Springer International Publishing AG, part of Springer Nature 2018

Authors and Affiliations

  • Salma Gharbi
    • 1
    Email author
  • Souad Harmand
    • 2
  • Sadok Ben Jabrallah
    • 1
  1. 1.University of CarthageBizerteTunisia
  2. 2.University Lille Nord de FranceValenciennesFrance

Personalised recommendations