Die Attach Adhesives and Films

  • Shinji Takeda
  • Takashi Masuko
  • Nozomu Takano
  • Teiichi Inada
Chapter
First Online:

Abstract

This chapter outlines the strong correlation between developments in electronic packaging technologies and required properties of die attach materials. An overview of die attach materials is summarized with the trends in the market. Die attach paste, adhesive tape for a lead on chip (LOC), die attach film, and the prospects of advanced die attach film are described in each section. The technical requirements of the die attach materials, which include high purity, fast curing, low stress, high package crack resistance, and multi-chip packaging are discussed.

Die attach films have become the main stream of die attach materials owing to their excellent properties and reliability. The future of advanced die attach films is explained with the introduction of adhesive film with dicing/die attach dual functionality.

The effects of adhesive properties such as peel strength and water absorption to improve package crack resistance are reported in detail. The development of die attach films with micro-phase separation structure for multi-layered packaging process is reviewed. Evaluation of die attach materials for next generation packages is also introduced.

Keywords

Die attach Adhesives Films Package crack resistance Advanced BGA/CSP Multi-chip package Low stress Peel strength Water absorption Chip warpage Polyimide Epoxy resin Acrylic polymer 
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Copyright information

© Springer International Publishing AG 2017

Authors and Affiliations

  • Shinji Takeda
    • 1
  • Takashi Masuko
    • 1
  • Nozomu Takano
    • 1
  • Teiichi Inada
    • 1
  1. 1.Hitachi Chemical Co., Ltd.TokyoJapan

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