Moulded Interconnect Devices

  • Adrien BrunetEmail author
  • Ulrich Gengenbach
  • Tobias Müller
  • Steffen Scholz
  • Markus Dickerhof
Part of the Springer Tracts in Mechanical Engineering book series (STME)


Moulded Interconnect Devices (MID) refer to free form components made of polymer with added electrical (conductors, isolators, etc.) and mechanical functions (carrier module, housing, etc). MID are being used in various industry sectors like telecommunication (antenna), automotive (motorcycle handlebars), medical (hearing aid) and many others, due to the easiness of integration thanks to the geometry freedom. This chapter discusses, in terms of advantages and main challenges, the main MID materials and technologies, such as Two-shot Injection Moulding, Laser Direct Structuring, Hot Embossing, Aerosol-Jet Printing, and presents an overview of their application sectors.


Injection Moulding Copper Film Emboss Process Conductor Crack Gold Bump 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    Franke J, Gausemeier J, Goth C, Dumitrescu R (2011) MID-Studies 2011—Markt- und Technologieanalyse. Eine Studie im Auftrag von Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e-v. (Ed), ErlangenGoogle Scholar
  2. 2.
    Franke J (1995) Integrierte Entwicklung neuer Produkt- und Produktiontechnologien für räumliche spritzgegossene Schaltungsträger (3D MID). Hanser, MunichGoogle Scholar
  3. 3.
    Osswald TA, Baur E, Brinkmann S (2006) International plastics handbook, 4th edn. Hanser, MünchenCrossRefGoogle Scholar
  4. 4.
    Franke J (2014) Three-dimensional molded interconnect devices (3D-MID). Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Hanser, MünchenCrossRefGoogle Scholar
  5. 5.
    ISO, 1133-1 (2011) Plastics—determination of the melt mass-flow rate (MFR) and melt volume-flow rate (MVR) of thermoplastics. International organization for standardizationGoogle Scholar
  6. 6.
    3-D MID e.V. Forschungsvereinigung Räumliche Elektronische Baugruppen [Online]. Available 21 Sept 2016
  7. 7.
    De Zwart RM, Tacken RA, Bolt PJ (2006) Development of a MID LED housing. In: Proceeding of the global conference on micro manufacture, GrenobleGoogle Scholar
  8. 8.
    Franke J (2013) Räumliche elektronische Baugruppen (3D-MID), Werkstoffe, Herstellung, Montage und Anwendungen für spritzgegossene Schaltungsträger. Hanser, MünchenCrossRefGoogle Scholar
  9. 9.
    LPKF laser and electronics [Online]. Available 21 Sept 2016
  10. 10.
    FAPS—Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik [Online]. Available 21 Sept 2016
  11. 11.
    Panasonic [Online]. Available 21 Sept 2016
  12. 12.
    Barali L, Ernst C, Elspass S (2006) Lasergestützte MID-Technologien. In: Geiger M et al (eds) Laser in der Elektronikproduktion & Feinwerktechnik—Tagunsband, ninth Erlanger Seminars LEF. Meisenbach, BambergGoogle Scholar
  13. 13.
    Heininger N, John W, Boßler H-J (2004) Fertigung von MID-Bauteilen vom Rapid Prototyping bis zur Seri emit innovativer LDS-Technologie. Firmenschrifft LPKF Laser & Electronics AG, GarbsenGoogle Scholar
  14. 14.
    Hoerber J, Goth C, Franke J (2012) Potential of aerosoljet prining For manufacturing 3-D MID. Innov’Days, PEP, BellignatGoogle Scholar
  15. 15.
    Goth C (2013) Analyse und optimierung der entwicklung und zuverlässigkeit räumlicher schaltungsträger (3D-MID). Meisenbach, BambergGoogle Scholar

Copyright information

© Springer International Publishing Switzerland 2017

Authors and Affiliations

  • Adrien Brunet
    • 1
    Email author
  • Ulrich Gengenbach
    • 1
  • Tobias Müller
    • 1
  • Steffen Scholz
    • 1
  • Markus Dickerhof
    • 1
  1. 1.Karlsruher Institut für Technologie, IAIKarlsruheGermany

Personalised recommendations