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Fast and Reliable Simulations of the Heating of Bond Wires

  • David Duque
  • Sebastian Schöps
Conference paper
Part of the Mathematics in Industry book series (MATHINDUSTRY, volume 22)

Abstract

We present an extended analytic formulation for the determination of the temperature distribution along a bond-wire within a package in order to extract the maximum allowable current to not exceed a specific temperature. The closed-form formula involves the essential physical parameters that define a package, i.e., moulding compound material and dimensions, bond-wire characteristics, etc. This is very important if one wants to assess the influence of (randomly distributed) parameter variations on the current capacity of the wire by means of uncertainty quantification methods.

Keywords

Bond wires Moulding compound Temperature distribution 

Notes

Acknowledgements

This work is a part of the project ‘Nanoelectronic Coupled Problems Solutions’ (nanoCOPS) funded by the European Union within FP7-ICT-2013 (grant no. 619166). The second author is also supported by the ‘Excellence Initiative’ of the German Federal and State Governments and the Graduate School of Computational Engineering at Technische Universitaet Darmstadt.

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Copyright information

© Springer International Publishing AG 2016

Authors and Affiliations

  1. 1.Technische Universität DarmstadtGraduate School of Computational Engineering and Institut für Theorie Elektromagnetischer Felder64289 DarmstadtGermany

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