Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers

  • Sebastian J. Tesarski
  • Artur Wymysłowski
  • Kamil Nouri Allaf


In the modern world, there is a tendency to miniaturize electronic devices. To do so, new materials with dedicated physical properties are needed. It seems like that nowadays a vast number of materials used in microelectronics are polymers. One of the problems is there is a large variety of them and mixing them could change their physical properties significantly. On the other hand new products require shorter time-to-market. This induces a need for shortened research and development (R&D) processes. Experimental research is time and money consuming. Using Advanced Computer Techniques it is possible to shorten the R&D time, for example, by running parallel simulations. It is obvious that in a selected group of materials with the best properties, it is necessary to conduct experimental validation of them. As the computer simulation only gives a tendency or trend rather than exact numerous values, which nevertheless in most of the cases is sufficient for optimization procedures. One such numerical tool is molecular modeling, which provides a possibility of extracting properties of different materials in micro and nanoscale as e.g. polymers. Polymers are used especially as moulding compounds in electronic packaging. The knowledge on thermomechanical properties of moulding compounds is essential in order to provide reliability prediction of the microelectronic devices on satisfactory level. The above said research describes analysis of commonly used polymers as moulding compound in reference to their conversion level. Full conversion level is never achieved and thus such an analysis can give some insight into the so-called real life problem. Although the molecular simulation in nanoscale is more accurate, it needs significantly more CPU power, for this reason an alternative method was suggested, which introduces modeling in mesoscale.


Atomistic Model Mesoscale Model Conversion Level Moulding Compound High Conversion Level 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



Calculations have been carried out at Wroclaw Centre for Networking and Supercomputing (WCSS) in Poland (


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Copyright information

© Springer International Publishing Switzerland 2015

Authors and Affiliations

  • Sebastian J. Tesarski
    • 1
  • Artur Wymysłowski
    • 1
  • Kamil Nouri Allaf
    • 1
  1. 1.Laboratory for Interconnecting and Packaging Electronic Circuits, Faculty of Microsystems Electronics and PhotonicsWrocław University of TechnologyWrocławPoland

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