Millimeter-Wave Substrates and System-Level Approach in Millimeter-Wave Research and Design

  • Mladen BožanićEmail author
  • Saurabh Sinha
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 658)


With device scaling, the number and the density of components that can be placed on chip increase. With every new process generation, more and more active devices can be placed into a small area of the IC chip. The phenomenon that is now known as Moore’s law indicates that the circuit density roughly doubles every 18 or 24 months.


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Copyright information

© The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerland AG 2020

Authors and Affiliations

  1. 1.University of JohannesburgJohannesburgSouth Africa

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