• Emmanuel E. GdoutosEmail author
Part of the Solid Mechanics and Its Applications book series (SMIA, volume 263)


Nanoindentation constitutes a powerful method for measuring the mechanical properties and the interface fracture toughness of thin films on substrates. In the case of a brittle film weakly bonded to the substrate nanoindentation can be used to delaminate the film from the substrate. The interface toughness is obtained from measurements of the applied load, delamination length, film thickness and film/substrate material properties.


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Authors and Affiliations

  1. 1.Academy of AthensAthensGreece

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