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Bond Wire Models

  • David J. Duque GuerraEmail author
  • Thorben Casper
  • Sebastian Schöps
  • Herbert De Gersem
  • Ulrich Römer
  • Renaud Gillon
  • Aarnout Wieers
  • Tomas Kratochvil ((Tomáš Kratochvíl))
  • Tomas Gotthans ((Tomáš Götthans))
  • Peter Meuris
Chapter
Part of the Mathematics in Industry book series (MATHINDUSTRY, volume 29)

Abstract

In this chapter, models for the heating in bond wires are presented. First, an analytic model is developed, which allows a fast characterisation of the bond wire properties, e.g., its time to failure. Secondly, a more accurate model using the finite integration technique for spatial discretisation is constructed. This model is also used to study the impact of manufacturing uncertainties, e.g., variable bond wire lengths, on the performance of bond wires.

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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • David J. Duque Guerra
    • 1
    Email author
  • Thorben Casper
    • 1
  • Sebastian Schöps
    • 1
  • Herbert De Gersem
    • 1
  • Ulrich Römer
    • 2
  • Renaud Gillon
    • 3
  • Aarnout Wieers
    • 3
  • Tomas Kratochvil ((Tomáš Kratochvíl))
    • 4
  • Tomas Gotthans ((Tomáš Götthans))
    • 4
  • Peter Meuris
    • 5
  1. 1.Technische Universität DarmstadtDarmstadtGermany
  2. 2.Technische Universität BraunschweigBraunschweigGermany
  3. 3.ON Semiconductor BVBAOudenaardeBelgium
  4. 4.Brno University of TechnologyBrnoCzech Republic
  5. 5.MAGWEL NVLeuvenBelgium

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