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Chip-Forming Processes at High-Speed Grinding

  • V. M. Shumyacher
  • O. G. KulikEmail author
  • S. A. Kryukov
Conference paper
Part of the Lecture Notes in Mechanical Engineering book series (LNME)

Abstract

This article presents the results of microanalysis obtained at high abrasive and metallic sludge increase, which can be used to explain in the mechanisms of chip formation, as well as the course of physical and mechanical processes occurring on the surface layers of the ground blanks. By controlling these processes, it is possible to achieve a reduction in thermal stress in the pair “abrasive grain—workpiece,” which, in turn, will allow obtaining the required quality of the surface layer of the workpieces and the specified dimensional accuracy with the highest productivity of abrasive processing. The reduction of thermal stress of the process in the condition of highest productivity will allow obtaining the required quality of the surface layer of the workpieces and the specified dimensional accuracy. The reduction of thermal stress of the process can be achieved by controlling the chip formation processes at high-speed grinding and selecting the appropriate ratio between the cutting speed and other processing parameters.

Keywords

Grinding Chip formation Chip types Dispersing products 

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Copyright information

© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • V. M. Shumyacher
    • 1
  • O. G. Kulik
    • 1
    Email author
  • S. A. Kryukov
    • 1
  1. 1.Volzhsky Polytechnic Institute (branch) Volgograd State Technical UniversityVolgograd RegionRussia

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