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Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates

  • Raffaele CoppetaEmail author
  • Ayoub Lahlalia
  • Darjan Kozic
  • René Hammer
  • Johann Riedler
  • Gregor Toschkoff
  • Anderson Singulani
  • Zeeshan Ali
  • Martin Sagmeister
  • Sara Carniello
  • Siegfried Selberherr
  • Lado Filipovic
Chapter

Abstract

Before fabrication, sensors are often designed, simulated, and optimized using the Technology Computer Aided Design (TCAD) tools to reduce the manufacturing costs and the prototype development cycle. In this chapter, the electro-thermo-mechanical behavior of gas sensor hotplates is simulated by means of the finite element method (FEM). In particular, FEM is primarily used to study the mechanical stability of the membrane, the temperature uniformity over the active area, and the power consumption of the sensor. Furthermore, the chapter deals with the appropriate choice of the initial and boundary conditions of the problem, which are necessary to obtain accurate numerical solutions.

Keywords

FEM Hotplate Joule effect Temperature Power dissipation Membrane bending Crack 

Notes

Acknowledgements

Financial support by the Austrian Federal Government (in particular from Bundesministerium für Verkehr, Innovation und Technologie and Bundesministerium für Wissenschaft, Forschung und Wirtschaft) represented by Österreichische Forschungsförderungsgesellschaft mbH and the Styrian and the Tyrolean Provincial Government, represented by Steirische Wirtschaftsförderungsgesellschaft mbH and Standortagentur Tirol, within the framework of the COMET Funding Programme is gratefully acknowledged.

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Copyright information

© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • Raffaele Coppeta
    • 1
    Email author
  • Ayoub Lahlalia
    • 2
  • Darjan Kozic
    • 3
  • René Hammer
    • 3
  • Johann Riedler
    • 3
  • Gregor Toschkoff
    • 1
  • Anderson Singulani
    • 1
  • Zeeshan Ali
    • 1
  • Martin Sagmeister
    • 1
  • Sara Carniello
    • 1
  • Siegfried Selberherr
    • 2
  • Lado Filipovic
    • 2
  1. 1.ams AGPremstaettenAustria
  2. 2.Institute for Microelectronics, TU WienViennaAustria
  3. 3.Materials Center Leoben Forschung GmbHLeobenAustria

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