Main Parasitic Effects in Contactless Wafer Testing

  • Alessandro FinocchiaroEmail author
  • Giovanni Girlando
  • Alessandro Motta
  • Alberto Pagani
  • Giuseppe Palmisano
Conference paper
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 573)


The paper presents an analysis of principal parasitic effects in contactless wafer-level testing. Contactless technology exploits an inductive coupling between a tester antenna and many integrated on-chip antennas (OCAs) able to transfer energy and exchange bidirectional data. Electromagnetic crosstalk between adjacent on-chip antennas and the eddy currents generated in the substrate were analyzed. Simulations, varying the thickness and the conductivity of the substrate, have highlighted the strengths of this approach. Moreover, a wafer scribe line pre-cutting, used to drastically reducing the eddy currents, was also adopted.


On-chip antenna Contactless testing Magnetic coupling Eddy currents 


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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • Alessandro Finocchiaro
    • 1
    Email author
  • Giovanni Girlando
    • 1
  • Alessandro Motta
    • 2
  • Alberto Pagani
    • 2
  • Giuseppe Palmisano
    • 3
  1. 1.STMicroelectronicsCataniaItaly
  2. 2.STMicroelectronicsAgrate BrianzaItaly
  3. 3.DIEEIUniversity of CataniaCataniaItaly

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