Main Parasitic Effects in Contactless Wafer Testing
The paper presents an analysis of principal parasitic effects in contactless wafer-level testing. Contactless technology exploits an inductive coupling between a tester antenna and many integrated on-chip antennas (OCAs) able to transfer energy and exchange bidirectional data. Electromagnetic crosstalk between adjacent on-chip antennas and the eddy currents generated in the substrate were analyzed. Simulations, varying the thickness and the conductivity of the substrate, have highlighted the strengths of this approach. Moreover, a wafer scribe line pre-cutting, used to drastically reducing the eddy currents, was also adopted.
KeywordsOn-chip antenna Contactless testing Magnetic coupling Eddy currents
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